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Antimicrobial Effect of Cellulose Nanofibrils (CNFs) and Biobased Additives in Polyvinyl Alcohol Nanocomposite Materials for Sustainable Food Packaging Application
F Valdebenito
,CP Quezada
,D Parra
,Valentina Rivera Concha
,Elizabeth Elgueta
,Rodrigo Cáceres
,R Cabezas
,C Farkas
,M Pereira
,L Azocar
+1 authors
Posted: 06 March 2026
10-(3,5-Di-tert-butylphenyl)-9-Mesitylacridinium Tetrafluoroborate
Yuki Itabashi
,Kei Ohkubo
Posted: 06 March 2026
Gas-Phase Phosphate Surface Modification of Iron Powders: Microstructural Evolution and Coating Formation Mechanisms
Mirzokhid A. Tukhtabayev
,Abdukayum R. Normirzaev
,Olga F. Minchukova
,Aliaksandr L. Zhaludkevich
Posted: 05 March 2026
Heat and Photon Energy Phenomena: Dealing with Matter at the Atomic and Electronic Levels
Mubarak Ali
Posted: 05 March 2026
Triple-Cation Perovskite Photoanodes for Solar Water Splitting: From Photovoltaic-Assisted to Immersed Photoelectrochemical Operation
Vera La Ferrara
,Marco Martino
,Antonio Marino
,Giovanni Landi
,Silvano Del Gobbo
,Nicola Lisi
,Rosanna Viscardi
,Alberto Giaconia
,Giulia Monteleone
Posted: 05 March 2026
Plant-Based Biomaterials as Bioinstructive Immunomodulators: Design Principles, Mechanisms, and Translational Challenges
Stefania Lamponi
Posted: 04 March 2026
Accurate Density Determination of Various Natural Stones Employing Archimedes’ Principle and a New Non-Destructive Liquid Pycnometer for Solids
Eriketi Loizidou
,Deepshikha Deepshikha
,Constantinos D. Zeinalipour-Yazdi
Posted: 04 March 2026
Enhanced Antibacterial Performance of PANI–CdS/Au Nanocomposites Synthesized by Chemical Routes
Raad Al-Kilabi
,Abdulameer H. Ali
,Hude Al-Allaq
,Elias F. Muhammed
,Sahib Alkulaibi
,Adel Alkhayatt
,Hussein Al-Shabani
,Thmr Ihsan
,Haider Al-Hello
Posted: 04 March 2026
Network Silsesquioxane-Based Organogel/Silicone Composites for the Long-Lasting Delivery of Nitric Oxide
Kyle D. Hallowell
,Fatima Naser Aldine
,Hope N. Vonder Brink
,Ashley K. Mockensturm
,Hitesh Handa
,Elizabeth J. Brisbois
,Alexis D. Ostrowski
,Joseph C. Furgal
Posted: 03 March 2026
Sequential Electrospinning of Asymmetric PDLLA/PVP-HA Scaffolds Functionalized with Glycine for Medical Device
Antonio Laezza
,Francesca Armiento
,Luigi Fabiano
,Serena Munaò
,Paola Campione
,Matteo Carrozzino
,Ileana Ielo
,Katja Schenke-Layland
,Giovanna De Luca
,Grazia Maria Lucia Messina
+3 authors
Posted: 03 March 2026
Strontium Substitution, Coordination Chemistry and Crystallisation Behaviour of Fluorapatite Glass-Ceramics in the SiO₂–Al₂O₃–P₂O₅–CaO/SrO–CaF₂ System
Tomas Duminis
Posted: 03 March 2026
Correlation Between Theoretical Permanganate Index Method and Electrochemical Responses of Cyclic Voltammetry for the Detection of Organic Matter
Paolo Yammine
,Nouha Sari-Chmayssem
,Hanna El-Nakat
,Darine Chahine
,Moomen Baroudi
,Farouk Jaber
,Ayman Chmayssem
Posted: 03 March 2026
Preparation and Properties Study of One-Part Additive Curing Silicone Composites Applying in Advanced Packaging
Yuwen Xu
,Liangjun Liu
,Wenfei Wang
,Minghua Jiang
,Haibing Yang
,Tingxin Chen
,Kun Jia
Posted: 03 March 2026
PPO Inhibitors as a Key Focus in Herbicide Discovery
Min Zhao
,Baojian Li
,Ying Gao
,Rui Zhang
,Subinur Ahmattohti
,Jie Li
,Xinbo Shi
Posted: 03 March 2026
Porous Organic Polymers with Azo, Azoxy and Azodioxy Linkages: Design, Synthesis and CO2 Adsorption Properties
Ivan Kodrin
,Ivana Biljan
Posted: 02 March 2026
pH and Temperature-Dependent Dissolution Kinetics of Commercial Lightly-Burned Magnesia: Bridging Methodological Gaps for Cement Applications
Xiaowen Zhang
,Juan Pablo Gevaudan
Posted: 02 March 2026
Influence of the Final Annealing Temperature on Al-Fe-Si Alloy Foil Microstructure and Properties
Xiuda Zhu
,Changle Xiao
,Xiubin Wang
,Xiaohu Chen
,Hongyan Wu
,Wei Chen
This study systematically investigates the effects of the final annealing temperature on the microstructural evolution and mechanical properties of an Al-Fe-Si alloy aluminum foil. Scanning electron microscopy (SEM) characterization and tensile tests are employed for analysis. As the annealing temperature is elevated from 240°C to 360°C, the average grain size increases monotonically from 5.2 μm to 9.6 μm. Continuous recrystallization is identified as the predominant grain growth mechanism.Tensile deformation exhibits the homogeneous-plastic behavior without localized necking. The tensile strength decreases significantly in the range of 240–300°C and subsequently undergoes a recovery stage at 300–360°C. The Pronounced elongation anisotropy is observed. The maximum elongation reaches 30–34% along the 45° direction relative to the rolling direction (RD), which is approximately 1.5 times that along the RD (0°).Comparative analysis of the anisotropy indices demonstrates that the aluminum foil annealed at 240°C achieves the minimal tensile strength anisotropy (13.0 MPa) and elongation anisotropy (−4.2%). This indicates optimal comprehensive mechanical performance.These findings provide a theoretical rationale for the industrial optimization of the annealing processes for Al-Fe-Si alloy foils. They are particularly valuable for balancing microstructural regulation and mechanical property enhancement in lithium-ion battery soft-packaging applications.
This study systematically investigates the effects of the final annealing temperature on the microstructural evolution and mechanical properties of an Al-Fe-Si alloy aluminum foil. Scanning electron microscopy (SEM) characterization and tensile tests are employed for analysis. As the annealing temperature is elevated from 240°C to 360°C, the average grain size increases monotonically from 5.2 μm to 9.6 μm. Continuous recrystallization is identified as the predominant grain growth mechanism.Tensile deformation exhibits the homogeneous-plastic behavior without localized necking. The tensile strength decreases significantly in the range of 240–300°C and subsequently undergoes a recovery stage at 300–360°C. The Pronounced elongation anisotropy is observed. The maximum elongation reaches 30–34% along the 45° direction relative to the rolling direction (RD), which is approximately 1.5 times that along the RD (0°).Comparative analysis of the anisotropy indices demonstrates that the aluminum foil annealed at 240°C achieves the minimal tensile strength anisotropy (13.0 MPa) and elongation anisotropy (−4.2%). This indicates optimal comprehensive mechanical performance.These findings provide a theoretical rationale for the industrial optimization of the annealing processes for Al-Fe-Si alloy foils. They are particularly valuable for balancing microstructural regulation and mechanical property enhancement in lithium-ion battery soft-packaging applications.
Posted: 02 March 2026
Optimization of Processing Parameters and Application Performance Evaluation of a High Thermal Conductivity, Low Thermal Resistance Gel
Yuwen Xu
,Danni Hong
,Liangjun Liu
,Wenfei Wang
,Minghua Jiang
,Haibing Yang
,Tingxin Chen
,Kun Jia
Thermal interface materials (TIMs) are essential for addressing heat dissipation challenges in high-performance electronic devices. Among various TIMs, thermal conductive gels exhibit significant potential in high heat flux applications due to their excellent flexibility and superior gap-filling capability. Current research primarily concentrates on the fabrication and performance characterization of novel thermal conductive gels, while comparatively little attention has been devoted to the optimization of processing parameters. Furthermore, existing characterization methods often fail to accurately replicate real-world operating conditions, resulting in discrepancies between laboratory measurements and actual performance. An orthogonal experimental design was adopted to systematically elucidate the influence of filler ratio, wetting time, and silicone oil viscosity on the bonding strength of thermal conductive gels. The filler ratio exerts the most significant influence, followed by silicone oil viscosity and wetting time. Subsequently, the thermal conductivity and thermal resistance of both commercial thermal conductive gels and the as-prepared gels were characterized using the steady-state heat flow method and the double-interface method, respectively. The prepared thermal conductive gel exhibits a thermal conductivity of 3.75 W·m−1·K−1 and a service thermal resistance of 0.611 ℃·W−1, outperforming commercial counterparts and demonstrating promising application potential. This study provides a practical reference for the development and engineering application of high thermal conductivity, low thermal resistance thermal conductive gels.
Thermal interface materials (TIMs) are essential for addressing heat dissipation challenges in high-performance electronic devices. Among various TIMs, thermal conductive gels exhibit significant potential in high heat flux applications due to their excellent flexibility and superior gap-filling capability. Current research primarily concentrates on the fabrication and performance characterization of novel thermal conductive gels, while comparatively little attention has been devoted to the optimization of processing parameters. Furthermore, existing characterization methods often fail to accurately replicate real-world operating conditions, resulting in discrepancies between laboratory measurements and actual performance. An orthogonal experimental design was adopted to systematically elucidate the influence of filler ratio, wetting time, and silicone oil viscosity on the bonding strength of thermal conductive gels. The filler ratio exerts the most significant influence, followed by silicone oil viscosity and wetting time. Subsequently, the thermal conductivity and thermal resistance of both commercial thermal conductive gels and the as-prepared gels were characterized using the steady-state heat flow method and the double-interface method, respectively. The prepared thermal conductive gel exhibits a thermal conductivity of 3.75 W·m−1·K−1 and a service thermal resistance of 0.611 ℃·W−1, outperforming commercial counterparts and demonstrating promising application potential. This study provides a practical reference for the development and engineering application of high thermal conductivity, low thermal resistance thermal conductive gels.
Posted: 02 March 2026
Application of Magnetic Resonance Tools for Qualification and Traceability of Mullets
Fabíola Helena dos Santos Fogaça
,Nara Regina Brandão Cônsolo
,Eduardo Solano
,Brenda S de Oliveira
,Luisa Souza Almeida
,Luiz Alberto Colnago
Posted: 02 March 2026
Preparation of High‑Performance FeCoNi Thin Films by Magnetron Sputtering
Xiufang Zhong
,YuZe Ge
,Zelei Feng
,Ke Chen
,Guohui Jin
,Lianze Ji
Posted: 02 March 2026
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