ARTICLE
|
doi:10.20944/preprints202305.2123.v1
Online: 30 May 2023 (11:18:53 CEST)
ARTICLE
|
doi:10.20944/preprints202201.0215.v1
Subject:
Engineering,
Mechanical Engineering
Keywords:
Bifurcation; Wafer; Spontaneous Symmetry Breaking; Finite Element Analysis (FEA); Simulations
Online: 14 January 2022 (14:31:12 CET)
ARTICLE
|
doi:10.20944/preprints202408.0477.v1
Subject:
Engineering,
Mechanical Engineering
Keywords:
Capacitive micromachined ultrasonic transducer; non-destructive testing; wafer bonding; pulse-echo response
Online: 7 August 2024 (07:02:33 CEST)
ARTICLE
|
doi:10.20944/preprints202403.0639.v1
Subject:
Engineering,
Industrial And Manufacturing Engineering
Keywords:
Thinning process, Bifurcation, Buckling, Wafer, Warpage, Curvature, Finite Element Analysis (FEA), Simulations.
Online: 11 March 2024 (13:51:10 CET)
ARTICLE
|
doi:10.20944/preprints202010.0594.v1
Subject:
Engineering,
Mechanical Engineering
Keywords:
Taiko Wafer, Warpage, Silicon, Silicon Carbide, Stoney Formula, Backside Metallization, Ultrathin Chips.
Online: 28 October 2020 (14:38:01 CET)
ARTICLE
|
doi:10.20944/preprints202012.0065.v1
Subject:
Social Sciences,
Decision Sciences
Keywords:
group decision-making; fuzzy analytic hierarchy process; consensus; wafer foundry; COVID-19 pandemic
Online: 2 December 2020 (14:10:13 CET)
ARTICLE
|
doi:10.20944/preprints202403.1230.v1
Subject:
Chemistry And Materials Science,
Materials Science And Technology
Keywords:
micro-light-emitting diode; indium tin oxide; wafer-scale characterization; high pixel per inch
Online: 20 March 2024 (13:17:30 CET)
ARTICLE
Subject:
Engineering,
Electrical And Electronic Engineering
Keywords:
automated visual inspection; convolutional neural network; deep learning; pattern classification; semiconductor inspection; wafer map
Online: 7 April 2020 (11:30:38 CEST)
ARTICLE
|
doi:10.20944/preprints202404.1301.v1
Subject:
Physical Sciences,
Applied Physics
Keywords:
AlGaN/GaN high electron mobility transistor; micro-raman spectroscopy; power electronic; packaged device; wafer-level
Online: 22 April 2024 (12:11:17 CEST)
ARTICLE
|
doi:10.20944/preprints202410.0483.v1
Subject:
Engineering,
Other
Keywords:
Top-emission organic light-emitting diodes; Electro-Optical Characteristics; Silicon wafer; Dopant concentration; Lifetime; Thermal conductivity
Online: 8 October 2024 (08:45:37 CEST)
ARTICLE
|
doi:10.20944/preprints202206.0245.v1
Subject:
Engineering,
Mechanical Engineering
Keywords:
MEMS vibrometer; Structural Health Monitoring (SHM); Guided Ultrasonic Waves (GUW); Fiber Metal Laminates (FML); wafer bonding
Online: 17 June 2022 (03:55:30 CEST)
ARTICLE
|
doi:10.20944/preprints202410.0898.v1
Subject:
Chemistry And Materials Science,
Nanotechnology
Keywords:
nanosecond laser; Si wafer; top Au film; liquid-nitrogen environment; Au/N double-element doping; nano-recrystallization of Si; mid-IR-vis absorption
Online: 11 October 2024 (10:21:31 CEST)
ARTICLE
|
doi:10.20944/preprints201810.0386.v1
Subject:
Chemistry And Materials Science,
Surfaces, Coatings And Films
Keywords:
physical vapor deposition; magnetron-sputtering; AlN/Al coating; silicon substrate; residual stresses; wafer curvature method; Nano-scale residual stress profiling; indentation failure modes; nanoindentation adhesion
Online: 17 October 2018 (12:36:39 CEST)