Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

MEMS Vibrometer for Structural Health Monitoring Using Guided Ultrasonic Waves

Jan Niklas Haus
* ORCID logo ,
Walter Lang
,
Thomas Roloff
ORCID logo ,
Liv Rittmeier
ORCID logo ,
Sarah Bornemann
ORCID logo ,
Michael Sinapius
,
Andreas Dietzel
ORCID logo
Version 1 : Received: 14 June 2022 / Approved: 17 June 2022 / Online: 17 June 2022 (03:55:30 CEST)

A peer-reviewed article of this Preprint also exists.

Haus, J.N.; Lang, W.; Roloff, T.; Rittmeier, L.; Bornemann, S.; Sinapius, M.; Dietzel, A. MEMS Vibrometer for Structural Health Monitoring Using Guided Ultrasonic Waves. Sensors 2022, 22, 5368. Haus, J.N.; Lang, W.; Roloff, T.; Rittmeier, L.; Bornemann, S.; Sinapius, M.; Dietzel, A. MEMS Vibrometer for Structural Health Monitoring Using Guided Ultrasonic Waves. Sensors 2022, 22, 5368.

Abstract

Structural health monitoring of lightweight constructions made of composite materials can be performed using guided ultrasonic waves. If modern fiber metal laminates are used, this requires integrated sensors that can record the inner displacement oscillations caused by the propagating guided ultrasonic waves. Therefore, we have developed a robust MEMS vibrometer that can be integrated with structural and functional compliance. This vibrometer is directly sensitive to the high-frequency displacements from structure-borne ultrasound when excited between its first and second natural frequency. The vibrometer is mostly realized by processes earlier developed for a pressure sensor but with additional femtosecond laser ablation and wafer bonding. The piezoresistive transducer made from silicon is encapsulated between top and bottom glass lids. The natural frequencies are experimentally determined using an optical micro vibrometer setup. The vibrometer functionality and usability for structural health monitoring are demonstrated on a customized test rig by recording application-relevant guided ultrasonic wave packages with a central frequency of 100 kHz at a distance of 200 mm from the exciting ultrasound transducer.

Keywords

MEMS vibrometer; Structural Health Monitoring (SHM); Guided Ultrasonic Waves (GUW); Fiber Metal Laminates (FML); wafer bonding

Subject

Engineering, Mechanical Engineering

Copyright: This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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