Advancements in Substrate Technologies and Design Challenges for 5G mmWave Systems

Substrates have become essential enabling materials for creating lightweight electronic components, particularly supporting advanced telecommunication technologies. This progress is driven by continuous advancements in novel substrate materials and cut-ting-edge fabrication techniques, pushing the limits of high-frequency device design. This paper explores both the challenges and breakthroughs in 5G mmWave substrate technology, focusing on recent developments in materials, device fabrication and integration methods that enhance performance and providing an in-depth analysis on the importance of mmWave technology. This paper highlights the key concerns in substrates design to researchers and academicians accelerates invention and commercialization of substrate designs in areas such as antenna engineering and integrated circuit technologies as well as addressing key issues like scalability and thermal impact in flexible substrates. Since matters related to material losses and substrates’ fabrication constraints are increasingly severe at high frequencies, mmWave substrates are highly needed to be look at, therefore this paper details the particular issues related to mmWave propagation and manufacturing design processes for high-frequency devices. Aims at optimizing antenna and system reliability by employing advanced design and materials as well as outlines the existing gaps that need a clarification to augment 5G mmWave infrastructure and services.