A twin-screw extruder was used to fabricate poly(butylene succinate) (PBS)/high density polyethylene (HDPE) blends (7:3 weight ratio) and blend-based nanocomposites. Carbon nanotubes (CNTs), graphene nanoplatelets (GNPs) and organoclays (15A and 30B) served as the nanofiller, while maleated HDPE (PEgMA) acted as an efficient compatibilizer for the blend. In the composites, individual nanofillers were mostly localized in HDPE domains, but some fillers were also observed at PBS-HDPE interfaces. The sea-island morphology of compatibilized blend evolved into a pseudo-co-continuous morphology in the composites. Differential scanning calorimetry results confirmed that PEgMA with HDPE evidently accelerated the crystallization of PBS in the blend. The possible nucleation effect of added fillers on PBS crystallization was obscured by the formation of quasi-connected HDPE domains, causing less PBS nucleation sites. The presence of nanofillers improved the thermal stability and burning anti-dripping behavior of the parent blend. The anti-dripping efficiency of added fillers followed the sequence: CNT>15A>30B>GNP. Rigidity of the blend was increased after formation of nanocomposites. In particular, adding GNP resulted in 31% increase in flexural modulus. Development of a pseudo-network structure in the composites was confirmed by measurement of rheological properties. Electrical resistivity of the blend was reduced by more than 6 orders of magnitude at 3 phr CNT loading, demonstrating the achievement of double percolation morphology.

Polymer-based (nano)composite foams, especially those having a microcellular structure, containing suitable conductive (nano)fillers, have been shown to act as good shielding materials, hence coming as promising to act as shields in electronic devices, limiting/avoiding electromagnetic interference (EMI) pollution. Nevertheless, due to their high (micro)structural complexity, related to their multiphase nature, there is still a lot of unawareness behind the shielding mechanisms acting in these materials, coming as a necessity to study their microstructure-cellular/porous structure-properties relations, especially in terms of their electrical conductivity and EMI shielding efficiency (EMI SE). To target and control the electrical conductivity through a controlled distribution/dispersion of conductive nanofillers, single or combined (nanohybrids), as there is a direct relation between electrical conductivity and EMI SE, as well as the main EMI shielding mechanisms working on the developed microcellular structure of the foams, which are expected to be absorption-dominated or absorption/multiple reflection-based, are two of the main objectives when combining polymer foaming with the addition of conductive nanofillers. The present review work considers the recent developments and trends on polymer-based foams containing conductive nanofillers, especially carbon-based such as carbon nanotubes or graphene-based materials, as well as similar porous structures created using trending technologies such as 3D printing, for EMI shielding applications. It is divided in different sections, starting with the strategy of microcellular foaming to develop polymer-based foams with enhanced EMI shielding characteristics, especially focusing on technologies and methods using supercritical CO2 (sCO2); continuing with the use of polymer foams as templates to synthesize carbon foams with improved EMI shielding performance for high use temperature applications; the recent strategy of combining different functional (nano)fillers to create hybrid nanofillers/nanohybrids to be used at lower amounts as conductive fillers in polymer foams; the control and selective distribution of the nanofillers in terms of favoring the formation of a more effective conductive network and hence promote the enhancement of the EMI SE; the very recent use of computational approaches to tailor the EMI shielding properties of composite foams; and the very trending possibility of creating cellular components with varied porous structures from these materials using 3D printing; to finish, some future perspectives are discussed.