ARTICLE
|
doi:10.20944/preprints202403.0639.v1
Subject:
Engineering,
Industrial And Manufacturing Engineering
Keywords:
Thinning process, Bifurcation, Buckling, Wafer, Warpage, Curvature, Finite Element Analysis (FEA), Simulations.
Online: 11 March 2024 (13:51:10 CET)
ARTICLE
|
doi:10.20944/preprints202010.0594.v1
Subject:
Engineering,
Mechanical Engineering
Keywords:
Taiko Wafer, Warpage, Silicon, Silicon Carbide, Stoney Formula, Backside Metallization, Ultrathin Chips.
Online: 28 October 2020 (14:38:01 CET)
ARTICLE
|
doi:10.20944/preprints202305.1513.v1
Subject:
Engineering,
Other
Keywords:
auxetic behavior; biodegradable; residual stress distribution; warpage; FE-based process simulation; computed tomography
Online: 22 May 2023 (11:03:38 CEST)
ARTICLE
|
doi:10.20944/preprints202402.1259.v1
Subject:
Engineering,
Mechanical Engineering
Keywords:
Bifurcation; Taiko wafers; Finite Element Analysis (FEA); ANSYS; Thermomechanical Simulations; Warpage; Modelling; Equivalent Thickness
Online: 22 February 2024 (07:50:28 CET)