In Taiwan, colorectal cancer is ranked second and third in terms of mortality and cancer incidence, respectively. In addition, medical expenditures related to colorectal cancer are considered to be the third highest. While advances in treatment strategies have provided cancer patients with longer survival, potentially harmful second primary cancers can occur. Therefore, second primary colorectal cancer analysis is an important issue with regard to clinical management. In this study, a novel predictive scheme was developed for predicting the risk factors associated with second colorectal cancer in patients with colorectal cancer by integrating five data mining classification techniques, including support vector machine, random forest, multivariate adaptive regression splines, extreme learning machine, and extreme gradient boosting. In total, 4,287 patients in the datasets provided by three hospital tumor registries were used. Our empirical results revealed that this proposed predictive scheme provided promising classification results and the identification of important risk factors for predicting second colorectal cancer based on accuracy, sensitivity, specificity, and area under the curve metrics. Collectively, our clinical findings suggested that the most important risk factors were the combined stage, age at diagnosis, BMI, surgical margins of the primary site, tumor size, sex, regional lymph nodes positive, grade/differentiation, primary site, and drinking behavior. Accordingly, these risk factors should be monitored for the early detection of second primary tumors in order to improve treatment and intervention strategies.

The main purpose of this research is to use “DMAIC” and “DMADV” framework of six sigma to reduce cost of projects, increase yields, improve performance and reduce defects. This study conclude that the sigma level of cement bag production in four production lines is “4.7 DPMO” values of 710 and the possibility of defects per unit of 11 possibilities this situation was handled by using six sigma. Any business or industry run only to satisfy customer and increase their profits, this can be attained as development of quality product..For the ranking of newly established universities the certification of those institutes is very important and also a critical process. For this process we used Lean six sigma approach that can identify the wastes that affect this process.Six sigma can be applied to any work field such as education, power optimization and other types of industries Six sigma “DMAIC” approach is also used for the testing of EDA tools that occurs due to the complex coding or configurations, flows and platforms they support. To improve the process quality of SDLC it’s necessary to remove the defects of system in advance along with thorough valuation of size and it also makes project accordant with real time environment

In many practical applications, it is more convenient to characterize the quality of production processes or service operations throughout the count of nonconformities. In the context of SPC, nonconformities are usually assumed to appear according to the binomial probability model. The conventional way for monitoring nonconformities involves Shewhart-type control procedures based on both constant and time-varying sample sizes. In this article, an EWMA scheme is proposed for monitoring the fraction of nonconforming items with time-varying sample sizes. The proposed control chart is referred to as the EWMAG-B and can be easily adapted to work with a constant sample size by fixing it at a needed value. By means of simulation, it was found out that the EWMAG-B chart outperforms the conventional p control chart in Phase II while detecting changes in the process level is wanted.

The paper investigates into the intricacies of semiconductor manufacturing, a highly complex process entailing a wide array of subprocesses and diverse equipment. Semiconductors are miniaturized integrated circuits comprising numerous components. The semiconductor manufacturing process begins with the thin disc-shaped silicon wafers. On each wafer, up to thousands of identical chips can be prepared depending upon the diameter of the wafer to build up the circuits layer by layer in a wafer fab. The size of the semiconductors requires a high number of units to be produced, thus necessitating a large amount of data to control for improving the semiconductor manufacturing process. Therefore, the collection and analysis of the equipment data, process data, and machine history data throughout the manufacturing process are required to diagnose faults, monitor the process, and manage the manufacturing process effectively. This research is focused on improving the semiconductor manufacturing process through a rigorous analysis of collected manufacturing process data, employing statistical process control (SPC), data mining techniques, and data-driven decision models. The project's primary objective is to increase the manufacturing process stability and productivity by utilizing the latest data-driven technologies in the scientific community. A structured review was undertaken, exploring contemporary data-driven methodologies in semiconductor manufacturing process improvement, specifically pertaining to process capability, product yield rate, and process stability. This review accentuates a comprehensive evaluation of data-driven methodologies applicable to conventional semiconductor manufacturing facilities, aiming to drive substantial process improvements. It features a detailed demonstration facilitating the selection of optimal semiconductor manufacturing processes to enhance overall operational performance. This study of process improvement in the semiconductor manufacturing steps through the application of data-driven methodologies will be effective in delivering advanced, real-time, and proactive control decisions throughout the manufacturing facilities. This endeavor is expected to promptly provide critical insights for enterprise manufacturing decision-makers to reduce manufacturing cycle time, improve the product yield rate, and increase the overall efficiency of the manufacturing process.