In this work, effects of 20 transition element additives on the interfacial adhesion energy and electronic structure of Al (111)/6H-SiC (0001) interfaces have been studied by first principles method. For clean Al (111)/6H–SiC (0001) interfaces, both Si-terminated and C-terminated interfaces have covalent bond characteristics. The C-terminated interface has stronger binding energy, which is mainly due to the stronger covalent bond formed by the larger charge transfer between C and Al. The results show that the introduction of many transition elements, such as 3d transitional group Mn, Fe, Co, Ni, Cu, Zn and 4d transitional group Tc, Ru, Rh, Pd, Ag, can improve the interfacial adhesion energy of the Si-terminated Al (111)/6H-SiC (0001) interface. However, for the C-terminated Al (111)/6H-SiC (0001) interface, only the addition of Co element can improve the interfacial adhesion energy. Bader charge analysis shows that the increase of interfacial binding energy is mainly attributed to more charge transfer.

In order to understand the hot deformation behavior of novel Cu/Al laminated composites, isothermal hot compression tests were conducted by Gleeble-1500D thermo-mechanical simulator. And the effect of bonding interface, deformation temperature and strain rate on the deformation behavior was analyzed. Results show that under the interface constraint effect, soft Al layer trends to flow synchronously with hard Cu layer. And further microstructure examinations indicate the cooperative deformation capability of Cu/Al composites increases with increasing stain rate and decreasing deformation temperature. Strain hardening exponent, calculated based on the true stress-true strain data, also proves the effect of deformation temperature and strain rate on the cooperative deformation behavior. Meanwhile, unique composites structure allows the Al matrix to exhibit the characteristic of dynamic recrystallization during the hot deformation process. Lastly, strain compensated Arrhenius-type constitutive equation was employed to describe the coupling effect of temperature, strain rate and strain on the flow stress.

In this paper, through high-temperature tensile tests of 55NiCrMoV7 steel, the high-temperature fracture behavior, microstructure evolution and carbide distribution characteristics of both thermal-mechanical coupling zone (fracture zone) and thermal stress zone (clamping zone) at different temperatures were studied. Intrinsic relationship between high temperature fracture and carbides types, distribution and size were revealed and evolution mechanism of microstructure near cracks in 55NiCrMoV7 hot-working die steel during high temperature deformation was clarified. Samples were stretched at different temperatures from 25 °C to 700 °C, and microscopic examinations were carried out by using SEM and TEM. The results showed that: With the increase of temperature, tensile strength and yield strength decreased, elongation and reduction of area increased, and fracture mode changed from brittle fracture to ductile fracture by transition temperature at about 400℃. During high temperature deformation, the grain dislocation density decreased, the tempered martensite decomposed, recovered, recrystallized, and then grain grew. M7C3 and M23C6 carbides precipitated and grew along the grain boundary, and a small amount of fine granular MC carbides were dispersed in the grain. The work done by the external force on the deformation zone would cause the temperature of it to be higher than tensile temperature, which provides thermodynamic conditions for the re-dissolution of small carbides near the fracture zone and the grain growth of large carbides, resulting in the decrease of small carbides and increase of large carbides in thermal-mechanical coupling zone.

Hot deformation at elevated temperature is essential to densify the particle reinforced Aluminum matrix composites (AMCs) and improve their performance. However, hot deformation behavior of the AMCs is sensitive to the variation of hot processing parameters. In this paper, optimal processing parameters of the dual-scale SiCp/A356 composites was determined to explore the control strategy of the microstructure. Hot compression tests were conducted at the temperature ranging from 460 to 520℃ under strain rates from 0.01 to 5 s−1. Constitutive equation and processing maps were presented to determine the hot processing parameters. Microstructure evolution of the dual-scale SiCp/A356 composites was analyzed. The strain rate of 0.62 ~ 5s-1 and deformation temperature of 495 ~ 518℃ is suitable for the hot processing. The number of DRX grains in the “safe” domains is larger and the dislocation density is lower compared to those of instability domains. DRX particles mainly occurred around SiC particles. The presence of SiC particles can promote effectively the DRX nucleation, which result in that the dynamic softening mechanism of the dual-scale SiCp/A356 composites is dominated DRX.