Working Paper Article Version 1 This version is not peer-reviewed

Hot Deformation Behavior and Microstructure Evolution of the Dual-Scale SiCp/A356 Composites Based on Optimal Hot Processing Parameters

Version 1 : Received: 16 May 2020 / Approved: 17 May 2020 / Online: 17 May 2020 (08:39:24 CEST)

A peer-reviewed article of this Preprint also exists.

Song, Y.; Wang, A.; Ma, D.; Xie, J.; Wang, Z.; Liu, P. Hot-Deformation Behavior and Microstructure Evolution of the Dual-Scale SiCp/A356 Composites Based on Optimal Hot-Processing Parameters. Materials 2020, 13, 2825. Song, Y.; Wang, A.; Ma, D.; Xie, J.; Wang, Z.; Liu, P. Hot-Deformation Behavior and Microstructure Evolution of the Dual-Scale SiCp/A356 Composites Based on Optimal Hot-Processing Parameters. Materials 2020, 13, 2825.

Abstract

Hot deformation at elevated temperature is essential to densify the particle reinforced Aluminum matrix composites (AMCs) and improve their performance. However, hot deformation behavior of the AMCs is sensitive to the variation of hot processing parameters. In this paper, optimal processing parameters of the dual-scale SiCp/A356 composites was determined to explore the control strategy of the microstructure. Hot compression tests were conducted at the temperature ranging from 460 to 520℃ under strain rates from 0.01 to 5 s−1. Constitutive equation and processing maps were presented to determine the hot processing parameters. Microstructure evolution of the dual-scale SiCp/A356 composites was analyzed. The strain rate of 0.62 ~ 5s-1 and deformation temperature of 495 ~ 518℃ is suitable for the hot processing. The number of DRX grains in the “safe” domains is larger and the dislocation density is lower compared to those of instability domains. DRX particles mainly occurred around SiC particles. The presence of SiC particles can promote effectively the DRX nucleation, which result in that the dynamic softening mechanism of the dual-scale SiCp/A356 composites is dominated DRX.

Keywords

dual-scale SiCp/A356 composites; hot deformation behavior; microstructure; constitutive equation; processing map

Subject

Chemistry and Materials Science, Materials Science and Technology

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