Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Hot Deformation Behaviour of Cu/Al Laminated Composites under Interface Constraint Effect

Version 1 : Received: 5 April 2018 / Approved: 9 April 2018 / Online: 9 April 2018 (07:55:59 CEST)

How to cite: Liu, S.; Wang, A.; Liang, T.; Xie, J. Hot Deformation Behaviour of Cu/Al Laminated Composites under Interface Constraint Effect. Preprints 2018, 2018040099. https://doi.org/10.20944/preprints201804.0099.v1 Liu, S.; Wang, A.; Liang, T.; Xie, J. Hot Deformation Behaviour of Cu/Al Laminated Composites under Interface Constraint Effect. Preprints 2018, 2018040099. https://doi.org/10.20944/preprints201804.0099.v1

Abstract

In order to understand the hot deformation behavior of novel Cu/Al laminated composites, isothermal hot compression tests were conducted by Gleeble-1500D thermo-mechanical simulator. And the effect of bonding interface, deformation temperature and strain rate on the deformation behavior was analyzed. Results show that under the interface constraint effect, soft Al layer trends to flow synchronously with hard Cu layer. And further microstructure examinations indicate the cooperative deformation capability of Cu/Al composites increases with increasing stain rate and decreasing deformation temperature. Strain hardening exponent, calculated based on the true stress-true strain data, also proves the effect of deformation temperature and strain rate on the cooperative deformation behavior. Meanwhile, unique composites structure allows the Al matrix to exhibit the characteristic of dynamic recrystallization during the hot deformation process. Lastly, strain compensated Arrhenius-type constitutive equation was employed to describe the coupling effect of temperature, strain rate and strain on the flow stress.

Keywords

Cu/Al laminated composites; deformation behavior; interface; microstructure; constitutive equation

Subject

Chemistry and Materials Science, Surfaces, Coatings and Films

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