Submitted:
30 October 2023
Posted:
31 October 2023
You are already at the latest version
Abstract
Keywords:
1. Introduction
2. Double-D (DD) IPT pad

3. Material characterization
3.1. Ferrite

3.2. Potting polyurethane (UR5608)

3.3. Polyamide casing (PA 2200)

3.4. Litz wire
| Ex | Ey=Ez | Gxy=Gxz | Gyz | ρxy=ρxz |
|---|---|---|---|---|
| 9100 MPa | 155 MPa | 42.4 MPa | 41.2 MPa | 0.40 |
3.5. Aluminium plate
3.6. Simulant pavement material


4. Instrumentation

5. Temperature calibration

6. Pad manufacture


7. Experimental setup


8. Finite-Element model
8.1. Geometry and mesh

8.2. Boundary conditions and loads
9. Results
9.1. Uniform temperature tests of the Partial Pad


9.2. Complete Pad energized in air


9.3. Complete Pad energized in pavement




10. Discussion
10.1. Insights into thermal-mechanical behaviour of full-scale pads
10.2. Sources of deviation between the experiment and simulations
|
Partial Pad #3 Pad without wires |
Oven temp. | 35°C | 50°C | 65°C | 80°C |
| Abs % diff | 19% | 5% | 6% | 8% | |
| RMSE (με) | 10.4 | 15.0 | 19.5 | 29.8 | |
|
Complete pad Suspended |
Ambient temp. | 20°C | 30°C | 40°C | 50°C |
| Abs % diff | 27% | 25% | 30% | 27% | |
| RMSE (με) | 28.1 | 31.1 | 36.6 | 37.3 | |
|
Complete pad Embedded |
Ambient temp. | 13°C | 20°C | 30°C | 40°C |
| Abs % diff | 37% | 32% | 46% | 49% | |
| RMSE (με) | 20.4 | 21.6 | 16.9 | 17.9 |

11. Conclusions
Acknowledgements
References
- G. A. Covic and J. T. Boys, “Modern trends in inductive power transfer for transportation applications,” IEEE J. Emerg. Sel. Top. Power Electron., vol. 1, no. 1, pp. 28–41, 2013. [CrossRef]
- V. Cirimele, M. Diana, F. Freschi, and M. Mitolo, “Inductive Power Transfer for Automotive Applications: State-of-the-Art and Future Trends,” IEEE Trans. Ind. Appl., vol. 54, no. 5, pp. 4069–4079, 2018. [CrossRef]
- S. Y. Choi, B. W. Gu, S. Y. Jeong, and C. T. Rim, “Advances in Wireless Power Transfer Systems for Roadway-Powered Electric Vehicles,” IEEE J. Emerg. Sel. Top. Power Electron., vol. 3, no. 1, pp. 18–36, Mar. 2015. [CrossRef]
- M. Budhia, J. T. Boys, G. A. Covic, and C. Y. Huang, “Development of a single-sided flux magnetic coupler for electric vehicle IPT charging systems,” IEEE Trans. Ind. Electron., vol. 60, no. 1, pp. 318–328, 2013. [CrossRef]
- F. Chen, N. Taylor, and N. Kringos, “Electrification of roads: Opportunities and challenges,” Appl. Energy, vol. 150, pp. 109–119, 2015. [CrossRef]
- M. Amirpour, S. Kim, M. P. Battley, P. Kelly, S. Bickerton, and G. Covic, “Coupled electromagnetic-thermal analysis of roadway inductive power transfer pads within a model pavement,” Appl. Therm. Eng., vol. 189, no. February, p. 116710, 2021. [CrossRef]
- S. Kim et al., “Thermal Evaluation of an Inductive Power Transfer Pad for Charging Electric Vehicles,” IEEE Trans. Ind. Electron., vol. 0046, no. c, 2021. [CrossRef]
- M. Alsayegh, M. Saifo, M. Clemens, and B. Schmuelling, “Magnetic and Thermal Coupled Field Analysis of Wireless Charging Systems for Electric Vehicles,” IEEE Trans. Magn., vol. 55, no. 6, pp. 1–4, 2019. [CrossRef]
- S. Zimmer, M. Helwig, A. Winkler, and N. Modler, “One-way vs. two-way coupled simulation: Investigation of thermal management of wireless power transfer modules for electric vehicles,” in 2022 Wireless Power Week (WPW), 2022, pp. 84–89. [CrossRef]
- N. Rasekh, S. Dabiri, N. Rasekh, M. Mirsalim, and M. Bahiraei, “Thermal analysis and electromagnetic characteristics of three single-sided flux pads for wireless power transfer,” J. Clean. Prod., vol. 243, p. 118561, 2020. [CrossRef]
- K. Hwang, S. Chun, U. Yoon, M. Lee, and S. Ahn, “Thermal analysis for temperature robust wireless power transfer systems,” 2013 IEEE Wirel. Power Transf. WPT 2013, pp. 52–55, 2013. [CrossRef]
- R. Wojda, V. P. Galigekere, J. Pries, and O. Onar, “Thermal Analysis of Wireless Power Transfer Coils for Dynamic Wireless Electric Vehicle Charging,” in 2020 IEEE Transportation Electrification Conference & Expo (ITEC), 2020, pp. 835–838. [CrossRef]
- K.-Y. Li, C. Piefke, T. Allen, S. Bickerton, H. Abdoli, and P. Kelly, “Computational modelling and experimental validation of structural response of ferrite core within road embedded IPT pad under mechanical loading,” Structures, vol. 46, pp. 1407–1421, Dec. 2022. [CrossRef]
- C. Piefke, S. Bickerton, P. Kelly, and T. Allen, “Structural and Thermo-mechanical Performance of Fragile Components Integrated in IPT Pads for Electric Roadway Applications,” University of Auckland, 2023.
- F. Chen, R. Balieu, E. Córdoba, and N. Kringos, “Towards an understanding of the structural performance of future electrified roads: a finite element simulation study,” Int. J. Pavement Eng., vol. 20, no. 2, pp. 204–215, 2019. [CrossRef]
- F. Chen, C. F. Coronado, R. Balieu, and N. Kringos, “Structural performance of electrified roads: A computational analysis,” J. Clean. Prod., vol. 195, pp. 1338–1349, 2018. [CrossRef]
- R. Ceravolo, G. Miraglia, C. Surace, and L. Zanotti Fragonara, “A Computational Methodology for Assessing the Time-Dependent Structural Performance of Electric Road Infrastructures,” Comput. Civ. Infrastruct. Eng., vol. 31, no. 9, pp. 701–716, 2016. [CrossRef]
- K.-Y. Li, C. Piefke, T. Allen, S. Bickerton, and P. Kelly, “Finite-Element Modelling And Experimental Validation Of A Double-D Pad Under Wheel Loading,” in 2022 Wireless Power Week (WPW), 2022, pp. 470–475. [CrossRef]
- ASTM International, “Standard Test Method for Flexural Strength of Advanced Ceramics at Ambient,” vol. 94, no. Reapproved, pp. 1–15, 1996.
- M. K. Moinuddin and S. Ramana Murthy, “Elastic behaviour of Mn Zn ferrites,” J. Alloys Compd., vol. 194, no. 1, pp. 105–107, Apr. 1993. [CrossRef]
- Micro-Measurements, “Tech Note TN-513-1: Measurement of thermal expansion coefficient using strain gauges.” Vishay Precision Group, Raleigh, North Carolina, pp. 119–129, 2010.
- Tokyo Measuring Instruments Laboratory Co. Ltd., “Strain Gauge Test Data for Gauge Type: FLAB-3-350-11 (3rd ed.).” Tokyo, 2018.
- G. R. Kalra, M. G. S. Pearce, S. Kim, D. J. Thrimawithana, and G. A. Covic, “A Power Loss Measurement Technique for Inductive Power Transfer Magnetic Couplers,” IEEE J. Emerg. Sel. Top. Ind. Electron., vol. 1, no. 2, pp. 113–122, Oct. 2020. [CrossRef]
- Ansys Inc., “Ansys Maxwell.” Canonsburg, Pennsylvania, 2022.
- American Society for Testing and Materials, “Standard Test Method for Tensile Properties of Plastics,” ASTM D638-14, 2014.
- ELECTROLUBE, “Technical Data Sheet: UR5806 Polyurethane Resin.” [Online]. Available online: https://electrolube.com/product/ur5608tough-high-hardness-polyurethane-resin/ (accessed on 1 January 2019).
- EOS GmbH, “Product Information: PA 2200.” [Online]. Available online: https://www.sculpteo.com/static/0.30.0-49/documents/materials/polyamide_PA2200/PA2200_Product_information_03-10_en.pdf (accessed on 1 February 2023).
- N. Simpson, R. Wrobel, and P. H. Mellor, “Estimation of equivalent thermal parameters of impregnated electrical windings,” IEEE Trans. Ind. Appl., vol. 49, no. 6, pp. 2505–2515, 2013. [CrossRef]
- T. A. Hahn, “Thermal Expansion of Copper from 20 to 800 K—Standard Reference Material 736,” J. Appl. Phys., vol. 41, no. 13, pp. 5096–5101, Dec. 1970. [CrossRef]
- Ansys Inc., “Ansys (Mechanical Application).” Canonsburg, Pennsylvania, 2022.
- J. C. Wilson, “The thermal expansion of aluminium from 0 to 650 C,” Proc. Phys. Soc., vol. 53, no. 3, pp. 235–244, May 1941. [CrossRef]
- American Society for Testing and Materials, “Standard Test Method for Compressive Properties of Rigid Plastics,” 2015.
- S.-C. Her and S. Y. Huang, “Thermal Strain Measured by Fiber Bragg Grating Sensors,” Sens. Mater, vol. 28, no. 9, pp. 939–946, 2016. [CrossRef]
- Y. Cengel, J. Cimbala, and R. Turner, Fundamentals of Thermal-Fluid Sciences (SI units), Third. New York, NY: McGraw Hill, 2008.
- H. Yu, G. Xu, X. Shen, X. Yan, and C. Cheng, “Low infrared emissivity of polyurethane/Cu composite coatings,” Appl. Surf. Sci., vol. 255, no. 12, pp. 6077–6081, 2009. [CrossRef]
- F. Steiner, F. Bleicher, and M. Klingenbrunner, “Emissivity Factor of Thermoplastic Materials for a Robot Bending Process,” in Annals of DAAAM & Proceedings, 2016, pp. 0664–0670. [CrossRef]
- Z. H. Liu, G. D. Ban, S. T. Ye, W. Y. Liu, N. Liu, and R. Tao, “Infrared emissivity properties of infrared stealth coatings prepared by water-based technologies,” Opt. Mater. Express, vol. 6, no. 12, p. 3716, 2016. [CrossRef]
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