preprints.org > engineering > mechanical engineering > doi: 10.20944/preprints202306.1989.v1

Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Version 1 : Received: 28 June 2023 / Approved: 28 June 2023 / Online: 28 June 2023 (10:26:07 CEST)

High in reliability, multi in function, strong in tracking and detecting, active phased array antennas have been widely applied in radar system. Heat dissipation is a major technological barrier preventing the realization of next-generation high-performance phased array antennas. As a result of the advancement of miniaturization and the in-tegration of microelectronics technology, the study and development of embedded di-rect cooling or heat dissipation has significantly enhanced the heat dissipation effect. In this paper, a novel swept-back fishnet embedded microchannel topology (SBFEMCT) is designed, and various microchannel models with different fishnet runner mesh den-sity ratios and different fishnet runner layers are established to characterize the chip Tmax, runner Pmax, and Tmax and analyze the thermal effect of SBFEMCT under these two operating conditions. The Pmax is reduced to 72.37% and 57.12% of the original at mesh density ratios of 0.5, 0.25, and 0.125, respectively. The maximum temperature reduction figures are average with little change in maximum velocity and a small increase in maximum pressure drop for the number of fishing mesh runner layers of 0-4. This paper provides a study of the latest embedded thermal dissipation from the dimension of a single chip to provide a certain degree of new ideas and ref-erences for solving the thermal technology bottleneck of next-generation high-performance phased array antennas.

embedded cooling; microchannel; heat dissipation; heat exchange

Engineering, Mechanical Engineering

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