Electroplating of Electronic Materials for Applications in Large Area Electronics: A Review

The attributes of electroplating as a low-cost, simple, scalable and manufacturable semiconductor deposition technique for the fabrication of large-area and nanotechnology-based device applications are discussed. These strengths of electrodeposition are buttressed experimentally using techniques such as X-ray diffraction, Ultraviolet-visible spectroscopy, Scanning electron microscopy, Atomic force microscopy, Energy-dispersive X-ray spectroscopy and photoelectrochemical cell studies. Based on the structural, morphological, compositional optical, and electronic properties evaluated results, it is evident that electroplating possesses the capabilities of producing high-quality semiconductors usable in producing excellent devices. In this paper, we will describe the progress of electroplating technique mainly for the deposition of semiconductor thin film materials, their treatment processes and fabrication of solar cells.