Preprint Article Version 1 This version is not peer-reviewed

Fully Solution-Processable Fabrication of Multi-Layered Circuits on Flexible Substrate Using Laser

Version 1 : Received: 8 January 2018 / Approved: 8 January 2018 / Online: 8 January 2018 (09:04:08 CET)

A peer-reviewed article of this Preprint also exists.

Ji, S.Y.; Choi, W.; Kim, H.-Y.; Jeon, J.-W.; Cho, S.-H.; Chang, W.S. Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing. Materials 2018, 11, 268. Ji, S.Y.; Choi, W.; Kim, H.-Y.; Jeon, J.-W.; Cho, S.-H.; Chang, W.S. Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing. Materials 2018, 11, 268.

Journal reference: Materials 2018, 11, 268
DOI: 10.3390/ma11020268

Abstract

The development of printing technologies has enabled the realization of electric circuit fabrication on flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of laser focal position and intensity. Based on these methods, the flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated with functional operations.

Subject Areas

interconnection; multi-layer patterning; laser sintering; femtosecond laser ablation

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