Stitch-Less Lithography Empowered by Multi-Dimensional Holography

Trends in Micro- and Nano-Lithography required for future development of large area applications ranging from high-packing-density electronics to solar cells are surveyed and outlined. Strategies to use direct laser writing to define etch masks over large areas by: i) fixed beam moving stage and ii) moving beam moving stage approaches are presented. The extension of planar 2D and stacked 2D (or 2.5D) fabrication methods into 3D micro- and nano-fabrication is discussed. One of the essential future characteristic of 3D nanolithography is real-time feedback capability. This can be realised via inherent 3D-capable holography, which bridges lithographic exposure control, wavefront sensing, and adaptive feedback, providing a pathway to stitch free, large area 3D patterning. The future of micro-fabrication is expected to evolve via highly specialised 3D architecture design and reduction of post-processing steps.