A Two-Stage Generative Design Process for Lightweight Additively Manufactured High-Performance Cooling Manifolds for Power Electronics

The study presents a novel process to design lightweight, high-performance cooling manifolds for power electronics using generative design (GD). The process begins with a baseline design that defines the constraints of the manifold with regard to the target cooling geometry and flow path. A GD flow optimization is then performed to minimize pressure drop and improve flow uniformity. Once a final fluid volume is obtained, a GD structural optimization is conducted to minimize weight and material usage. The final design demonstrated a 74.4% increase in heat transfer coefficient, an 87.3% improvement in uniformity, and a 63.3% reduction in weight.