Low Cost DLW Setup for Fabrication of Photonics Integrated Circuits

The development of photonic integrated circuits (PICs) for data communication, sensing, and quantum computing is hindered by the high complexity and cost of traditional fabrication methods, which rely on expensive equipment, limiting accessibility for research and prototyping. This study introduces a Direct Laser Writing (DLW) system designed as a low-cost alternative, utilizing an XY platform for precise substrate movement and an optical system comprising a collimator and lens to focus the laser beam. Operating on a single layer, the system employs SU-8 photoresist to fabricate polymer based structures on substrates such as ITO covered glass. Preparation involves thorough cleaning, spin coating with photoresist, and pre and post-baking to ensure material stability. This approach reduces dependence on costly infrastructure, making it suitable for academic settings and enabling rapid prototyping. A user interface and custom slicer process standard .dxf files into executable commands, enhancing operational flexibility. Experimental results demonstrate a resolution of 10 µm, with successful patterning of structures, including diffraction grids, waveguides, and multimode interference devices. This system aims to transform PIC prototype fabrication into a cost-effective, accessible process.