Chen, Z.; Feng, H.; Zhang, G.; Yang, C. Design and Implementation of Automatic Cooling Case Based on High-Power and High-Density Power Supply Array. Electronics2023, 12, 4353.
Chen, Z.; Feng, H.; Zhang, G.; Yang, C. Design and Implementation of Automatic Cooling Case Based on High-Power and High-Density Power Supply Array. Electronics 2023, 12, 4353.
Chen, Z.; Feng, H.; Zhang, G.; Yang, C. Design and Implementation of Automatic Cooling Case Based on High-Power and High-Density Power Supply Array. Electronics2023, 12, 4353.
Chen, Z.; Feng, H.; Zhang, G.; Yang, C. Design and Implementation of Automatic Cooling Case Based on High-Power and High-Density Power Supply Array. Electronics 2023, 12, 4353.
Abstract
Multi-board electronic cases with high density and high power modules are widely used in industrial power supply management. With the improvement of case performance and miniaturization requirements, heat dissipation becomes one of the important factors to be considered in the design process. First,The existing small electronic thermal design methods focus on heat dissipation structure or heat source layout optimization,and ignores on-load test for modeling analysis. Second,The selected power module has on-load power consumption, resulting in relatively low calorific value and the effectiveness of thermal design cannot be verified. Third, The thermal lacks Intelligent monitoring and feedback control mechanism. In order to solve these problems, this paper designs a kind of heat dissipation case with intelligent temperature control based on high-power and high-density power supply array. Based on the extremely miniaturization design principle, we adopt the composite heat dissipation mode based on conduction and supplemented by forced air cooling . The case is made of magnesium and aluminum alloy with a perforated design. Finally, we compare and analyze with the existing cooling design. The results show that the case is smaller in volume, and the cooling performance parameters are slightly better than the existing case. Under the condition of high-density and high-power design, The output power of the whole system is not less than 10kw and the lowest packing-level density is not less than 47w/cm2 with high reliability, portability and practicability. It also provides technical support and prototype support for the standardized design of similar power arrays.
Keywords
thermal design; miniaturization; high power; high density; automation
Subject
Engineering, Electrical and Electronic Engineering
Copyright:
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
