Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Top-Down models across CPU architectures: Applicability and comparison in an HPC environment

Version 1 : Received: 9 August 2023 / Approved: 9 August 2023 / Online: 10 August 2023 (09:24:01 CEST)

A peer-reviewed article of this Preprint also exists.

Banchelli, F.; Garcia-Gasulla, M.; Mantovani, F. Top-Down Models across CPU Architectures: Applicability and Comparison in a High-Performance Computing Environment. Information 2023, 14, 554. Banchelli, F.; Garcia-Gasulla, M.; Mantovani, F. Top-Down Models across CPU Architectures: Applicability and Comparison in a High-Performance Computing Environment. Information 2023, 14, 554.

Abstract

Top-down models are defined by hardware architects to provide information on the utilization of the different hardware components. The target is to isolate the users from the complexity of the hardware architecture while giving them insight into how efficiently the code is using the resources. In this paper, we explore the applicability of 4 top-down models defined for different hardware architectures powering state-of-the-art HPC clusters (Intel Skylake, Fujitsu A64FX, IBM Power9, and Huawei Kunpeng 920) and propose a model for AMD Zen 2. We study a parallel CFD code used for scientific production to compare these 5 Top-Down models. We evaluate the level of insight achieved, the clarity of the information, the ease of use, and the conclusions that each one allows us to reach.

Keywords

Performance models; Top-Down model; HPC applications; MareNostrum 4; A64FX; Power 9; Zen 2

Subject

Computer Science and Mathematics, Hardware and Architecture

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