Version 1
: Received: 2 August 2023 / Approved: 7 August 2023 / Online: 8 August 2023 (10:54:19 CEST)
Version 2
: Received: 12 August 2023 / Approved: 14 August 2023 / Online: 15 August 2023 (09:06:37 CEST)
How to cite:
Ge, J.; Liu, L.; Jin, X.; Zhang, L.; Jiao, Y.; Wang, Q.; Wang, Y. Facile Synthesis Monodisperse SiO2 Sphere And Their Application Performances in Chemical Mechanical Polishing. Preprints2023, 2023080655. https://doi.org/10.20944/preprints202308.0655.v2
Ge, J.; Liu, L.; Jin, X.; Zhang, L.; Jiao, Y.; Wang, Q.; Wang, Y. Facile Synthesis Monodisperse SiO2 Sphere And Their Application Performances in Chemical Mechanical Polishing. Preprints 2023, 2023080655. https://doi.org/10.20944/preprints202308.0655.v2
Ge, J.; Liu, L.; Jin, X.; Zhang, L.; Jiao, Y.; Wang, Q.; Wang, Y. Facile Synthesis Monodisperse SiO2 Sphere And Their Application Performances in Chemical Mechanical Polishing. Preprints2023, 2023080655. https://doi.org/10.20944/preprints202308.0655.v2
APA Style
Ge, J., Liu, L., Jin, X., Zhang, L., Jiao, Y., Wang, Q., & Wang, Y. (2023). Facile Synthesis Monodisperse SiO<sub>2</sub> Sphere And Their Application Performances in Chemical Mechanical Polishing. Preprints. https://doi.org/10.20944/preprints202308.0655.v2
Chicago/Turabian Style
Ge, J., Qiuqin Wang and Yongkui Wang. 2023 "Facile Synthesis Monodisperse SiO<sub>2</sub> Sphere And Their Application Performances in Chemical Mechanical Polishing" Preprints. https://doi.org/10.20944/preprints202308.0655.v2
Abstract
Abstract: The chemical mechanical polishing (CMP) has been widely used for surface modification of critical materials and components and provided global planarization of topography with a low post-planarization slope high quality and efficiency. The colloidal silica slurries play an important role in the finishing processes of optical components. Monodisperse mesoporous silica nanospheres were synthesized with different surfactant by Stöber method. Their architectural features and texture parameters were characterized by XRD, FTIR, N2 adsorption–desorption isotherms, SEM, XPS, and TGA techniques. The spherical SiO2 products presented with the controllable 50-150 nm particle size and distribution. The AFM micrographs reveal that flat and smooth surfaces without distinct scratches residual particles are achieved by using the as-obtained composite particles as abrasives[The particle size of SiO2 slurry plays a critical role in the chemical-mechanical polishing process.
Keywords
Stöber method; SiO2 sphere; chemical mechanical polishing; SiO2 slurry
Subject
Chemistry and Materials Science, Materials Science and Technology
Copyright:
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Received:
15 August 2023
Commenter:
Jinlong Ge
Commenter's Conflict of Interests:
Author
Comment:
(1) A reference[10] is added in the first paragraph. It is essential to develop a novel green slurry to perform CMP for sapphire wafers used for high performance devices, eliminating the environmental contamination and reducing potential harmful impact on operators[10]. (2)The title of the graph in Figure 9 has been updated. Figure 9. AFM images of the surfaces after CMP with SiO2 microsphere. (a)(b) CTAC-SiO2,(c)(d)CTAB-SiO2,(e)(f) STAB-SiO2,(g) (h) HDBAC-SiO2.
Commenter: Jinlong Ge
Commenter's Conflict of Interests: Author
(2)The title of the graph in Figure 9 has been updated. Figure 9. AFM images of the surfaces after CMP with SiO2 microsphere. (a)(b) CTAC-SiO2,(c) (d)CTAB-SiO2,(e) (f) STAB-SiO2,(g) (h) HDBAC-SiO2.