Submitted:
04 May 2023
Posted:
05 May 2023
You are already at the latest version
Abstract
Keywords:
1. Introduction
2. Materials and Methods
2.1. Materials
2.2. Analytical characterization
2.3. Mechanical testing
2.4. SCC susceptibility and crack-branching
3. Results
3.1. Analystical characterization
3.2. Mechanical testing
3.3. Pitting and cracking susceptibility
3.4. Crack-branching susceptibility
4. Discussion
4.1. Susceptibility to SCC initiation: pit-to-crack transition
4.2. Susceptibility to SCC propagation: crack-branching
5. Conclusions
- The sinter-based manufacturing process used to produce BMD SS316L resulted in lower residual stresses and lower strength, which contributed to its higher resistance to the initiation of SCC by making it less electrochemically active.
- The combination of microscopy features comprising large grain aggregates, equiaxed grain morphology, weak crystallographic texture, and a large content of twin boundaries increases the crack-branching resistance of BMD SS316L.
- The porosity distribution of BMD SS316L had a mixed impact on its SCC resistance. While these defects accelerated the pit-to-crack transition by weakening the passive film, they also acted as crack arrestors by blunting the crack tips.
Supplementary Materials
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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| Printing parameters | Debinding parameters | ||
|---|---|---|---|
| Extrude line width: | 0.5 mm | Debinding time: | 15 h |
| Deposited layer height: | 0.15 mm | Debinding temperature: | 50 °C |
| Contour shell thickness: | 1.50 mm | Debinding pressure: | Atmospheric |
| Extrusion nozzle size: | 0.40 mm | Sintering parameters | |
| Extrusion rate: | 30 mm/s | Heating rate: | ~1.0 °C/min |
| Extrusion temperature: | 175 °C | Thermal debinding temperature: | 550 °C |
| Build plate temperature: | 60 °C | Thermal debinding dwell time: | 2 h |
| Sintering scale factors: | X=Y=Z=1.15 | Sintering temperature: | 1350 °C |
| Bulk volume raster pattern: | +45°/-45° each layer | Sintering atmosphere: | Ar >99.997% vol. |
| Infill density: | 100% | Sintering dwell time: | 2 h |
| Print orientation: | Vertical (Z) | Cooling rate: | Furnace cooling |
| Alloy | Source | Fe | C | Cr | Ni | Mo | Si | Mn | P | S |
|---|---|---|---|---|---|---|---|---|---|---|
| BMD SS316L | ICP-AES | Bal. | 0.020 | 16.3 | 10.4 | 2.12 | 0.61 | 1.22 | 0.010 | 0.010 |
| SA SS316L | MTR | Bal. | 0.012 | 16.1 | 10.1 | 2.03 | 0.46 | 0.92 | 0.036 | 0.002 |
| CD SS316L | MTR | Bal | 0.019 | 16.7 | 10.1 | 2.03 | 0.41 | 1.72 | 0.024 | 0.025 |
| UNS S31603 |
ASTM A213 [36] | Bal. | Max. 0.035 | 16.0 18.0 | 10.0 14.0 | 2.00 3.00 | Max. 1.00 | Max. 2.00 | Max. 0.045 | Max. 0.030 |
| Alloy | Non-metallic inclusions (%) | δ-ferrite phase (%) | Average grain size (µm) | Aspect ratio | Twin boundaries (%) | Schmid factor {111}<110> |
|---|---|---|---|---|---|---|
| BMD SS316L | 3.23 | 6.09 | 40.8 ± 23.8 | 3.1 ± 2.4 | 53.2 | 0.69 |
| SA SS316L | 0.01 | 7.86 | 16.2 ± 8.5 | 2.2 ± 1.3 | 45.5 | 0.94 |
| CD SS316L | 0.39 | 0.95 | 43.5 ± 33.6 | 3.9 ± 3.6 | 39.4 | 0.96 |
| Alloy | AYS (MPa) |
Microhardness (HV2) | Bulk density (g/cm3) |
Relative bulk porosity (%) |
|---|---|---|---|---|
| BMD SS316L | 167 ± 2 | 117.1 ± 3.2 | 7.564 ± 0.013 | 5.21 |
| SA SS316L | 293 ± 6 | 163.9 ± 2.5 | 7.935 ± 0.025 | 0.57 |
| CD SS316L | 646 ± 8 | 277.3 ± 3.2 | 7.953 ± 0.027 | 0.35 |
| Alloy | Unstressed C-ring (0%AYS) in boiling solution after 1 week | Stressed C-ring (90%AYS) in boiling solution after cracking | ||
|---|---|---|---|---|
| Pit size (µm) in flat surface | Pit size (µm) in curved surface | Pit size (µm) |
Pit depth (µm) |
|
| BMDSS3 16L | 112 ± 117 | 89 ± 154 | 406 ± 359 | 190 ± 135 |
| SA SS316L | 31 ± 27 | 28 ± 16 | 213 ± 178 | 58 ± 27 |
| CD SS316L | 88 ± 61 | 27 ± 11 | 205 ± 118 | 130 ± 84 |
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