Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

First of its Kind: A Test Artifact for Direct Laser Writing

Version 1 : Received: 6 October 2022 / Approved: 18 October 2022 / Online: 18 October 2022 (09:59:13 CEST)

A peer-reviewed article of this Preprint also exists.

Fritzsche, S.; Weimann, C.; Pauw, B. R.; Sturm, H. First of Its Kind: A Test Artifact for Direct Laser Writing. Measurement Science and Technology, 2023. https://doi.org/10.1088/1361-6501/acc47a. Fritzsche, S.; Weimann, C.; Pauw, B. R.; Sturm, H. First of Its Kind: A Test Artifact for Direct Laser Writing. Measurement Science and Technology, 2023. https://doi.org/10.1088/1361-6501/acc47a.

Abstract

With Direct Laser Writing (DLW) maturing in all aspects as a manufacturing technology a toolset for quality assurance must be developed. In this work we want to introduce a first of its kind test artifact. Test artifacts are standardized 3D models with specific geometric feature to evaluate the performance of writing parameters. Test artifacts are already common in other 3D additive manufacturing technologies e.g. Selective Laser Melting. The test artifact introduced in this work was developed in particular to accommodate 1) the high geometrical resolution of DLW structures and 2) the limited possibilities to examine the resulting structure. Geometric accuracy, surface adhesion as well as confocal raman spectroscopy results were considered when evaluating the design of the test artifact. We will explain the individual features and design considerations of our DLW test artifact. The difference between two slicers, Cura and 3DPoli, and the implications on measured feature sizes and the general shape is quantified. The measured geometries are used to derive a general design guide for a specific combination of photoresist, laser power and scanning speed and to analyse the geometric accuracy of a structure produced using these guidelines.

Keywords

test artifact; two photon polymerization; Direct Laser Writing; quality infrastructure; multi photon lithography

Subject

Physical Sciences, Optics and Photonics

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