Article
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Locally LSR Over-Molding of Textile Integrated Actors and Sensors
Version 1
: Received: 26 August 2019 / Approved: 26 August 2019 / Online: 26 August 2019 (13:48:04 CEST)
How to cite: Micus, S.; Pachl, H.; Gresser, G.T. Locally LSR Over-Molding of Textile Integrated Actors and Sensors. Preprints 2019, 2019080267 Micus, S.; Pachl, H.; Gresser, G.T. Locally LSR Over-Molding of Textile Integrated Actors and Sensors. Preprints 2019, 2019080267
Abstract
The protection of electronics against environmental influences and mechanical loads is important for integration of conventional electronics in textile conductive tapes. For this purpose, the sensors on the tapes are molded with plastic locally. This process step is recognized in the injection molding process. The molding compound is then later selected depending on: The field of application, the parameters of the manufacturing process and the textile tape properties. We have designed a mould for liquid silicone (LSR) as well as for the textile and electronic insertions. The cavities are sealed by a local compression of the textile and the two inserts are positioned with position pins representing the main aspect of the mould design. The sampling tool and the process parameter optimization are mainly based on the material properties of the silicone and the mechanical sensitivity of the inserts. To reduce the deformation of the circuit boards by the melt front and ensuring the functionality of the electronics a low-pressure process is used.
Keywords
Injection molding, smart textiles, e-textiles, integration of electronics in textiles
Subject
Engineering, Electrical and Electronic Engineering
Copyright: This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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