Preprint Article Version 1 This version is not peer-reviewed

Low-Dissipation Thermosets Derived from Oligo(2,6-dimethyl phenylene oxide)-containing Benzoxazines

Version 1 : Received: 14 March 2018 / Approved: 15 March 2018 / Online: 15 March 2018 (03:49:52 CET)

A peer-reviewed article of this Preprint also exists.

Chen, C.-H.; Lee, K.-W.; Lin, C.-H.; Juang, T.-Y. Low-Dissipation Thermosets Derived from Oligo(2,6-Dimethyl Phenylene Oxide)-Containing Benzoxazines. Polymers 2018, 10, 411. Chen, C.-H.; Lee, K.-W.; Lin, C.-H.; Juang, T.-Y. Low-Dissipation Thermosets Derived from Oligo(2,6-Dimethyl Phenylene Oxide)-Containing Benzoxazines. Polymers 2018, 10, 411.

Journal reference: Polymers 2018, 10, 411
DOI: 10.3390/polym10040411

Abstract

Poly(2,6-dimethyl phenyl oxide) (PPO) is known for its low dissipation factor. To achieve insulating materials with low dissipation factor for high-frequency communication application, a monomer-type benzoxazine (P-APPO) and a main-chain-type benzoxazine (BPA-APPO) were prepared from an amine end-capped oligo (2,6-dimethyl phenylene oxide) (APPO). The APPO was prepared from a nucleophilic substitution of a phenol-end capped oligo (2,6-dimethyl phenylene oxide) (a commercial product, SA 90) with fluoronitrobenzene, and followed by catalytic hydrogenation. After self-curing or curing with a dicyclopentadiene-phenol epoxy (HP 7200), thermosets with high-Tg and low-dissipation factor can be achieved. Furthermore, the resulting epoxy thermosets show better thermal and dielectric properties than those of epoxy thermoset cured from its precursor SA90, demonstrating it is a successful modification in simultaneously enhancing the thermal and dielectric properties.

Subject Areas

low-dissipation factor; thermosets; benzoxazines

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