Submitted:
15 June 2026
Posted:
16 June 2026
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Abstract
Keywords:
1. Introduction
2. Laser Powder Bed Fusion: Process Overview and Surface Feature Origins
2.1. Process Fundamentals
2.2. Origins of Surface Roughness in L-PBF
2.3. Residual Stress Generation
2.4. Near-Surface Porosity
3. Surface Characterization of As-Built L-PBF Parts
3.1. Profilometric Methods
3.2. Residual Stress Measurement
3.3. Surface Microstructure Characterization
3.4. Chemical State of the Surface
4. Fatigue Testing Methodologies for L-PBF Alloys
4.1. Specimen Geometry and Preparation
4.2. Loading Modes and Stress Ratios
4.3. S-N Curve Determination and Statistical Treatment
5. Mechanisms of Surface-Driven Fatigue Failure in L-PBF Alloys
5.1. Surface Roughness as a Stress Concentrator
5.2. Residual Stress Effects on Fatigue Crack Propagation
5.3. Near-Surface Porosity as Crack Initiation Sites
5.4. Microstructural Effects at the Surface
5.5. Environmental and Oxidation Effects
6. Alloy-Specific Fatigue Performance: Effect of Surface Condition
6.1. Titanium Alloys: Ti-6Al-4V
6.2. Nickel Superalloys: IN718 and IN625
6.3. Aluminum Alloys: AlSi10Mg and Al6061
6.4. Stainless Steel: 316L
7. Post-Processing Surface Treatments and Their Efficacy
7.1. Mechanical Polishing and Machining
7.2. Shot Peening and Laser Shock Peening
7.3. Burnishing Methods
7.3.1. Slide Burnishing and Roller Burnishing
7.3.2. Rotational Burnishing
7.3.3. Low Plasticity Burnishing (LPB)
7.3.4. Electrical Current-Assisted Burnishing (ECAB)
7.4. Electrochemical Polishing and Chemical Etching
7.5. Abrasive Flow Machining
7.6. Laser Polishing
7.7. Hybrid and Combined Approaches
8. Modeling and Predictive Approaches
8.1. Process-Surface-Fatigue Simulation Chains
8.2. Fracture Mechanics-Based Fatigue Life Prediction
8.3. Machine Learning Approaches
9. Research Gaps and Future Directions
10. Conclusions
References
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| Method | Ra Reduction | CRS Depth | Complex Geometry | Key Limitation |
| Machining / CNC | **** (Ra < 0.5 µm) | Minimal (tensile risk) | Poor | Tensile RS; inaccessible surfaces |
| Shot Peening | * (Ra may increase) | 0.1-0.5 mm | Moderate | Roughness increase; saturation |
| Laser Shock Peening | *(Minimal) | 1-3 mm | Moderate | High cost; ablative coating needed |
| Electrochemical Polishing | *** (Ra < 1 µm) | Slight compressive | Excellent | Tensile RS at grain boundaries |
| Abrasive Flow Machining | *** (Ra 1-4 µm) | Compressive layer | Good (internal) | Non-uniform removal in circuits |
| Laser Polishing | ** (Ra 1-5 µm) | Tensile risk | Good | Residual ripples; tensile RS reintroduction |
| Slide Burnishing | *** (Ra ~0.3 µm) | 0.1-0.3 mm | Moderate | Work-hardening limits; limited depth |
| Rotational Burnishing | *** (Ra ~0.4 µm) | > 0.5 mm; CRS > 1000 MPa | Moderate | Thermal effects; process optimization needed |
| Low Plasticity Burnishing | *** (Ra < 0.5 µm) | 0.2-0.8 mm | Moderate | Multiple passes required for hard alloys |
| ECAB (Current-Assisted) | **** (Ra < 0.3 µm) | > 0.5 mm (enhanced) | Moderate | Specialized setup; current density control |
| HIP + Peening (Hybrid) | *** (after surface step) | 1-3 mm post-peen | Poor for internal channels | High cost; long cycle time |
| Ultrasonic-assisted burnishing | *** (Ra < 0.2 µm) | 0.3-1.0 mm | Moderate | Tool wear; resonant frequency tuning; line-of-sight required |
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