Using SPS Sintering System in Fabrication of Advanced Semiconductor Materials

Kamil Kaszyca; Marcin Chmielewski; Bartosz Bucholc; Piotr Błyskun; Fatima Nisar; Jerzy Rojek; Rafał Zybała

doi:10.20944/preprints202402.0711.v1

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preprints.org > chemistry and materials science > metals, alloys and metallurgy > doi: 10.20944/preprints202402.0711.v1

Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Using SPS Sintering System in Fabrication of Advanced Semiconductor Materials

^* ,

Version 1 : Received: 9 February 2024 / Approved: 9 February 2024 / Online: 13 February 2024 (08:13:28 CET)

A peer-reviewed article of this Preprint also exists.

Kaszyca, K.; Chmielewski, M.; Bucholc, B.; Błyskun, P.; Nisar, F.; Rojek, J.; Zybała, R. Using the Spark Plasma Sintering System for Fabrication of Advanced Semiconductor Materials. Materials 2024, 17, 1422. Kaszyca, K.; Chmielewski, M.; Bucholc, B.; Błyskun, P.; Nisar, F.; Rojek, J.; Zybała, R. Using the Spark Plasma Sintering System for Fabrication of Advanced Semiconductor Materials. Materials 2024, 17, 1422.

Abstract

The interest in the Spark Plasma Sintering (SPS) technique has continuously increased over the last few years. This article shows the possibility of the development of a SPS device used for material processing and synthesis both in both scientific and industrial applications. This work presents an example of processing Arc-Meleted (half-Heusler, cobalt triantimonide) and SHS-synthesized semiconductors (bismuth telluride) materials with SPS device. The system functionalities expansion is presented, showing the possible way of increasing the information amount obtained about SPS processes and using the SPS apparatus for conducting synthesis of materials and increasing reproducibility and accuracy of process parameters control.

Keywords

Spark Plasma Sintering; arc melting; semiconductor materials; half-Heusler; bismuth telluride; cobalt triantimonide; SHS; SPS

Subject

Chemistry and Materials Science, Metals, Alloys and Metallurgy

Copyright: This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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