Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

In-situ Stereo-DIC with Thermal Imaging as a Process Monitoring Method in Vacuum-Assisted Thermoforming

Version 1 : Received: 23 January 2024 / Approved: 24 January 2024 / Online: 24 January 2024 (08:06:28 CET)

A peer-reviewed article of this Preprint also exists.

Varedi, R.; Buffel, B.; Desplentere, F. In Situ Stereo Digital Image Correlation with Thermal Imaging as a Process Monitoring Method in Vacuum-Assisted Thermoforming. J. Manuf. Mater. Process. 2024, 8, 49. Varedi, R.; Buffel, B.; Desplentere, F. In Situ Stereo Digital Image Correlation with Thermal Imaging as a Process Monitoring Method in Vacuum-Assisted Thermoforming. J. Manuf. Mater. Process. 2024, 8, 49.

Abstract

This experimental study probes the dynamic behaviour of a 3mm ABS sheet during positive mould vacuum-assisted thermoforming. In this process, the sheet undergoes large and fast deformations, caused by the applied vacuum and mechanical stretching by the mould. The objective is to elucidate the complexities of these large, rapid and non-isothermal deformations. The non-isothermal conditions are caused by the radiative heating of the sheet, convective heat loss to the surrounding air and conductive heat transfer from the sheet to the mould. Utilizing stereo Digital Image Correlation (DIC) in tandem with thermal imaging, the present study accurately maps the occurring displacement, strain and strain rate field in relation to real-time temperature variation of the material. The study progresses to observe the ABS material from the moment it contacts the mould until it conforms to a positive 250mm diameter semi-sphere cast aluminium mould. The DIC methods are validated by comparing thickness values derived from DIC’s principal strain directions to ultrasonic thickness gauge readings. This knowledge not only broadens the understanding of the thermo-mechanical behaviour of the material but also aids in optimizing process parameters for improved thickness uniformity in thermoformed products.

Keywords

Thermoforming; In-situ stereo DIC; Thermal camera synchronization; Forming step; Strain full field

Subject

Engineering, Industrial and Manufacturing Engineering

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