Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Microstructures and Corrosion Properties of Wire Arc Additive Manufactured Copper-Nickel Alloys

Version 1 : Received: 8 January 2024 / Approved: 9 January 2024 / Online: 9 January 2024 (09:19:18 CET)

A peer-reviewed article of this Preprint also exists.

Song, J.; Jimenez, X.A.; To, A.C.; Fu, Y. Microstructures and Corrosion Properties of Wire Arc Additive Manufactured Copper–Nickel Alloys. Materials 2024, 17, 876. Song, J.; Jimenez, X.A.; To, A.C.; Fu, Y. Microstructures and Corrosion Properties of Wire Arc Additive Manufactured Copper–Nickel Alloys. Materials 2024, 17, 876.

Abstract

The 70/30 copper–nickel alloy is mainly used in critical parts with more demanding conditions in marine settings. There is a need for innovative methods that offer fast production and cost-effectiveness to supplement current copper–nickel alloy manufacturing processes. In this study, we employ wire-arc additive manufacturing (WAAM) to fabricate the 70/30 copper–nickel alloy. The as-built microstructure is characterized by columnar grains with prominent dendrites and chemical segregation in the inter-dendritic area. The aspect ratio of the columnar grain increases with increasing travel speed (TS) at the same wire feed speed (WFS). This is in contrast to an equiaxed grain structure with a more random orientation of conventional sample. The sample built with a WFS of 8 m/min, TS of 1000 mm/min, and a track distance of 3.85 mm exhibits superior corrosion properties in the 3.5 wt% NaCl solution compared to the conventional one, as evidenced by a higher film resistance and breakdown potential, along with a lower passive current density of the WAAM sample. The corrosion morphology reveals the critical roles played by the nickel element unevenly distributed between the dendrite core and inter-dendritic area.

Keywords

70/30 copper-nickel; wire arc additive manufacturing; dendritic feature; chemical segregation; corrosion properties; sodium chloride solution

Subject

Engineering, Other

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