Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Formation of Multiscale Porous Surfaces via Evaporation-Induced Aggregation of Imprinted Nanowires with Highly Viscous Photocurable Materials

Version 1 : Received: 2 January 2024 / Approved: 3 January 2024 / Online: 3 January 2024 (16:42:04 CET)

How to cite: Kim, M.S.; Shin, S.; Kim, W.Y.; Lee, S.H.; Park, S.R.; Kim, S.; Cho, Y.T. Formation of Multiscale Porous Surfaces via Evaporation-Induced Aggregation of Imprinted Nanowires with Highly Viscous Photocurable Materials. Preprints 2024, 2024010278. https://doi.org/10.20944/preprints202401.0278.v1 Kim, M.S.; Shin, S.; Kim, W.Y.; Lee, S.H.; Park, S.R.; Kim, S.; Cho, Y.T. Formation of Multiscale Porous Surfaces via Evaporation-Induced Aggregation of Imprinted Nanowires with Highly Viscous Photocurable Materials. Preprints 2024, 2024010278. https://doi.org/10.20944/preprints202401.0278.v1

Abstract

Numerous structures at the nano- and microscale manifest distinctive properties with far-reaching implications across diverse fields, including electronics, electricity, medicine, and surface engi-neering. Established methods such as nanoimprint lithography, photolithography, and self-assembly play crucial roles in the fabrication of nano- and microstructures; however, they exhibit limitations in generating high-aspect-ratio structures when utilizing high-viscosity pho-tocurable resins. In response to this inherent challenge, we propose a highly cost-effective ap-proach facilitating the direct replication of high-aspect-ratio structures, specifically nanowires, through the utilization of anodized aluminum substrates. This study elucidates the streamlined fabrication process for multiscale porous surfaces achieved through the evaporation-induced in-tegration of solid nanowires printed with high-viscosity photocurable resin.

Keywords

Anodic Aluminum Oxide(AAO); Nano-wires; UV Curable Resin; Viscosity; Surface Tension; High Aspect Ratio; Surface Treatment

Subject

Engineering, Mechanical Engineering

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