Zhou, Y.; Wang, J. Mechanical Properties of Thermally Annealed Cu/Ni and Cu/Al Multilayer Thin Films: Solid Solution vs. Intermetallic Strengthening. Metals2024, 14, 256.
Zhou, Y.; Wang, J. Mechanical Properties of Thermally Annealed Cu/Ni and Cu/Al Multilayer Thin Films: Solid Solution vs. Intermetallic Strengthening. Metals 2024, 14, 256.
Zhou, Y.; Wang, J. Mechanical Properties of Thermally Annealed Cu/Ni and Cu/Al Multilayer Thin Films: Solid Solution vs. Intermetallic Strengthening. Metals2024, 14, 256.
Zhou, Y.; Wang, J. Mechanical Properties of Thermally Annealed Cu/Ni and Cu/Al Multilayer Thin Films: Solid Solution vs. Intermetallic Strengthening. Metals 2024, 14, 256.
Abstract
In this study, Cu/Ni and Cu/Al multilayer thin films with individual layer thickness varying from 25 nm to 200 nm were deposited at room temperature and further annealed up to 300 ℃. The mechanical and microstructural properties of the multilayers were characterized by nanoindentation, x-ray diffraction, and scanning electron microscopy. Both systems exhibited an increase in hardness with increasing annealing temperature. However, the Cu/Ni system showed a gradual and moderate (up to 30%) hardness increase from room temperature to 300 ℃, while the Cu/Al system showed a sharp increase (~150%) between 125℃ and 200℃. This distinct strengthening behavior is attributed to solid solution formation in Cu/Ni and diffusion-activated intermetallic formation in Cu/Al.
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