Version 1
: Received: 27 December 2023 / Approved: 27 December 2023 / Online: 27 December 2023 (14:47:13 CET)
How to cite:
Lee, G.S.; Kim, Y.G.; Lee, C.W.; Hong, S.M.; Han, K.Y. An Attachable/detachable Hybrid Functional Tape for Micro-chip Transcription for High-yield Direct Semiconductors. Preprints2023, 2023122121. https://doi.org/10.20944/preprints202312.2121.v1
Lee, G.S.; Kim, Y.G.; Lee, C.W.; Hong, S.M.; Han, K.Y. An Attachable/detachable Hybrid Functional Tape for Micro-chip Transcription for High-yield Direct Semiconductors. Preprints 2023, 2023122121. https://doi.org/10.20944/preprints202312.2121.v1
Lee, G.S.; Kim, Y.G.; Lee, C.W.; Hong, S.M.; Han, K.Y. An Attachable/detachable Hybrid Functional Tape for Micro-chip Transcription for High-yield Direct Semiconductors. Preprints2023, 2023122121. https://doi.org/10.20944/preprints202312.2121.v1
APA Style
Lee, G.S., Kim, Y.G., Lee, C.W., Hong, S.M., & Han, K.Y. (2023). An Attachable/detachable Hybrid Functional Tape for Micro-chip Transcription for High-yield Direct Semiconductors. Preprints. https://doi.org/10.20944/preprints202312.2121.v1
Chicago/Turabian Style
Lee, G.S., Suk Min Hong and Kwan Young Han. 2023 "An Attachable/detachable Hybrid Functional Tape for Micro-chip Transcription for High-yield Direct Semiconductors" Preprints. https://doi.org/10.20944/preprints202312.2121.v1
Abstract
As the global semiconductor market is growing steadily, the need for optimization of the man-ufacturing process is paramount. For example, in the process of transferring the semiconductor chips to the substrate, each chip needs to be individually separated from the dicing tape via a plunger. In this process, however, the fixed chip is not easily removed from the tape due to strong adhesion, and the chip can become damaged if it is forcibly pulled out. Therefore, the present paper reports the development of functional adhesive tapes that initially adhere strongly to the semi-conductor chip on the dicing tape but can be easily removed after transfer. The fabricated functional tape has an initial adhesion of 350 gf, which enables firm fixing of the semiconductor chip to be transferred, and a final adhesion of 0.8 gf after UV curing, thereby facilitating removal of the chip without damage after transfer. Therefore, the fabricated functional tape is expected to contribute to the optimization of the semiconductor manufacturing process and is expected to be useful in the semiconductor package manufacturing process.
Engineering, Electrical and Electronic Engineering
Copyright:
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
