Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Influence of Humidity and Temperature on Mechanical Properties of Corrugated Board – Numerical Investigation

Version 1 : Received: 16 July 2023 / Approved: 17 July 2023 / Online: 17 July 2023 (08:11:45 CEST)

A peer-reviewed article of this Preprint also exists.

Cornaggia, A.; Gajewski, T.; Knitter-Piątkowska, A.; Garbowski, T. Influence of Humidity and Temperature on Mechanical Properties of Corrugated Board - Numerical Investigation. BioResources 2023, 18, 7490–7509, doi:10.15376/biores.18.4.7490-7509. Cornaggia, A.; Gajewski, T.; Knitter-Piątkowska, A.; Garbowski, T. Influence of Humidity and Temperature on Mechanical Properties of Corrugated Board - Numerical Investigation. BioResources 2023, 18, 7490–7509, doi:10.15376/biores.18.4.7490-7509.

Abstract

Paper is a material whose mechanical properties are highly dependent on humidity and temperature. Which naturally also builds the relationship between the stiffness and strength of corrugated board and changing weather conditions. In this paper, attention is focused on the dependence of the physical properties of the cardboard on changes in humidity and temperature, which undergo dynamic fluctuations both during the production of corrugated board and during its storage. Two techniques were used to test this effect, namely numerical homogenization and global sensitivity analysis. Both methods were implemented to determine the theoretical relationships between the change in humidity and/or temperature in each layer of corrugated board and its global bending, compression and shear stiffness. The procedure was used to analyze different types of 5-ply and 3-ply cardboard. The obtained results allowed to build a complete map of the relationship between the change in humidity of selected layers and the strength characteristics of the full assembly.

Keywords

Corrugated board; humidity; temperature; mechanical properties; numerical homogenization; sensitivity analysis

Subject

Engineering, Mechanical Engineering

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