Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

Version 1 : Received: 20 September 2021 / Approved: 22 September 2021 / Online: 22 September 2021 (13:24:41 CEST)

How to cite: Xu, P.; Wei, Z.; Jia, L.; Zhao, Y.; Han, G.; Si, C.; Ning, J.; Yang, F. ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release. Preprints 2021, 2021090384 (doi: 10.20944/preprints202109.0384.v1). Xu, P.; Wei, Z.; Jia, L.; Zhao, Y.; Han, G.; Si, C.; Ning, J.; Yang, F. ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release. Preprints 2021, 2021090384 (doi: 10.20944/preprints202109.0384.v1).

Abstract

Zero-rate output (ZRO) drift induces deteriorated micro-electromechanical system (MEMS) gy-roscope performances, severely limiting its practical applications. Hence, it is vital to explore an effective method toward ZRO drift reduction. In this work, we conduct an elaborate investigation on the impacts of the internal and packaging stresses on the ZRO drift at the thermal start-up stage, and propose a temperature-induced stress release method to reduce the duration and magnitude of ZRO drift. Self-developed high-Q dual mass tuning fork gyroscopes (TFGs) are adopted to study the correlations between temperature, frequency and ZRO drift. Furthermore, a rigorous finite element simulation model is built based on the actual device and packaging structure, revealing the temperature and stresses distribution inside TFGs. Meanwhile, the relationship between temperature and stresses are deeply explored. Moreover, we introduce a temperature-induced stress release process to generate thermal stresses and reduce the temperature-related device sensitivity. By this way, the ZRO drift duration is drastically reduced from ~2000 s to ~890 s, and the drift magnitude decreases from ~0.4 °/s to ~0.23 °/s. This stress release method achieves a small bias instability (BI) of 7.903 °/h and a low angle random walk (ARW) of 0.792 °/√h, and the long-term bias performance is significantly improved.

Keywords

ZRO drift; MEMS gyroscope; internal and packaging stresses; finite element analysis; stress release

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