Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Design Optimization of Centrifugal Microfluidic "Lab-on-a-Disc" Systems towards Fluidic Larger-Scale Integration

Version 1 : Received: 12 May 2021 / Approved: 13 May 2021 / Online: 13 May 2021 (11:00:52 CEST)
Version 2 : Received: 7 June 2021 / Approved: 8 June 2021 / Online: 8 June 2021 (12:07:35 CEST)

A peer-reviewed article of this Preprint also exists.

Ducrée, J. Design Optimization of Centrifugal Microfluidic “Lab-on-a-Disc” Systems towards Fluidic Larger-Scale Integration. Appl. Sci. 2021, 11, 5839. Ducrée, J. Design Optimization of Centrifugal Microfluidic “Lab-on-a-Disc” Systems towards Fluidic Larger-Scale Integration. Appl. Sci. 2021, 11, 5839.

Abstract

Enhancing the degree of functional multiplexing while assuring operational reliability and manufacturability at competitive costs are crucial components to enable comprehensive sample-to-answer automation, e.g., for use in common, decentralized “Point-of-Care” or “Point-of-Use” scenarios. This paper demonstrates a model-based ‘digital twin’ approach which efficiently supports the algorithmic design optimization of exemplary centrifugo-pneumatic (CP) dissolvable-film (DF) siphon valves towards larger-scale integration (LSI) of well-established “Lab-on-a-Disc” (LoaD) systems. Obviously, the spatial footprint of the valves and their upstream laboratory unit operations (LUOs) have to fit, at a given radial position prescribed by its occurrence in the assay protocol, into the locally available disc space. At the same time, the retention rate of rotationally actuated valve and, most challenging, its band width related to unavoidable experimental tolerances need to slot into a defined interval of the practically allowed frequency envelope. A set of design rules, metrics, and methods and instructive showcases for computationally assisted optimization of valve structures are presented.

Keywords

centrifugal microfluidics, Lab-on-a-Disc, large-scale integration, reliability, tolerances, band width, packing density

Subject

Engineering, Mechanical Engineering

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