Electroplating of Electronic Materials for Applications in Large Area Electronics: A Review

A.A. Ojo; I.M. Dharmadasa

doi:10.20944/preprints201806.0433.v1

Preprint Review Version 1 Preserved in Portico This version is not peer-reviewed

Version 1 : Received: 26 June 2018 / Approved: 26 June 2018 / Online: 26 June 2018 (16:18:18 CEST)

The attributes of electroplating as a low-cost, simple, scalable and manufacturable semiconductor deposition technique for the fabrication of large-area and nanotechnology-based device applications are discussed. These strengths of electrodeposition are buttressed experimentally using techniques such as X-ray diffraction, Ultraviolet-visible spectroscopy, Scanning electron microscopy, Atomic force microscopy, Energy-dispersive X-ray spectroscopy and photoelectrochemical cell studies. Based on the structural, morphological, compositional optical, and electronic properties evaluated results, it is evident that electroplating possesses the capabilities of producing high-quality semiconductors usable in producing excellent devices. In this paper, we will describe the progress of electroplating technique mainly for the deposition of semiconductor thin film materials, their treatment processes and fabrication of solar cells.

Electroplating; Semiconductors; Large area electronics; Characterisation; Solar cells

MATERIALS SCIENCE, Surfaces, Coatings & Films

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Electroplating of Electronic Materials for Applications in Large Area Electronics: A Review

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