PreprintArticleVersion 1Preserved in Portico This version is not peer-reviewed
A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction
Version 1
: Received: 7 January 2018 / Approved: 9 January 2018 / Online: 9 January 2018 (03:27:22 CET)
How to cite:
Liang, L.; Zhang, J.; Xu, Y.; Zhang, Y.; Wang, W.; Yang, J. A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction. Preprints2018, 2018010072. https://doi.org/10.20944/preprints201801.0072.v1
Liang, L.; Zhang, J.; Xu, Y.; Zhang, Y.; Wang, W.; Yang, J. A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction. Preprints 2018, 2018010072. https://doi.org/10.20944/preprints201801.0072.v1
Liang, L.; Zhang, J.; Xu, Y.; Zhang, Y.; Wang, W.; Yang, J. A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction. Preprints2018, 2018010072. https://doi.org/10.20944/preprints201801.0072.v1
APA Style
Liang, L., Zhang, J., Xu, Y., Zhang, Y., Wang, W., & Yang, J. (2018). A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction. Preprints. https://doi.org/10.20944/preprints201801.0072.v1
Chicago/Turabian Style
Liang, L., Wei Wang and Jian Yang. 2018 "A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction" Preprints. https://doi.org/10.20944/preprints201801.0072.v1
Abstract
In this paper, the nanoscale dissipative mechanisms of a Cu pad in a Ball Grid Array (BGA) packaging structure during isothermal ageing and uniaxial tension were investigated by the molecular dynamics (MD) method and experiments. From the result of the isothermal ageing test, a nonuniform consumption of Cu and large amount of Kirkendall voids were observed at the interface of Cu and Cu3Sn. To study the effect of pressure and orientation on this phenomenon, MD simulations were conducted on four types of Cu-Cu3Sn interface structures with different orientations of Cu. By comparing the diffusion coefficients of atoms in those cases, it was found that the tensile stress would inhibit the diffusion of atoms, whereas compressive stress would accelerate it, and this would be more significant under a larger magnitude of stress and temperature. Note that, in the model with the (101) surface Cu at the interface, both Cu and Cu3Sn have a higher diffusion coefficient compared with the model with (001) surface Cu. Thus, the orientation of Cu will also contribute to the uniform consumption of the pad. Uniaxial tension simulation combined with DXA and CSP analyses on those models also shows the model with (001) surface Cu has a greater mechanical reliability in our simulations and related experiments.
Copyright:
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
