Preprint Article Version 1 This version is not peer-reviewed

Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer

Version 1 : Received: 15 March 2017 / Approved: 16 March 2017 / Online: 16 March 2017 (08:50:05 CET)

A peer-reviewed article of this Preprint also exists.

Zhang, L.; Liu, Z.-Q.; Yang, F.; Zhong, S.-J. Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer. Materials 2017, 10, 327. Zhang, L.; Liu, Z.-Q.; Yang, F.; Zhong, S.-J. Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer. Materials 2017, 10, 327.

Journal reference: Materials 2017, 10, 327
DOI: 10.3390/ma10040327

Abstract

Cu6Sn5 whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag3Sn fibers can be observed around Cu6Sn5 whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu6Sn5 whiskers can be observed, and hexagonal rod structure is the main morphology of Cu6Sn5 whiskers. A hollow structure can be observed in hexagonal Cu6Sn5 whiskers, and a screw dislocation mechanism was used to represent the Cu6Sn5 growth. Based on mechanical property testing and finite element simulation, Cu6Sn5 whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer.

Subject Areas

Cu6Sn5 whiskers; Ag3Sn fibers; mechanical property; screw dislocation

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