Thermal analysis of a hypereutectic Al-Si alloy used for an automotive part was carried out in this research work. Solidification characteristics are recognized from the Temperature-time curve and its corresponding derivatives. This analysis was successfully used in a simulation software program with the aim of improving the resultant simulation accuracy. In this study, different types of molds, with and without cooling systems, were designed and used. The melt present in the furnaces of the factory was used to simulate the casting process. The effect of different cooling rates (1.2ºC/s, 2ºC/s, 2.3ºC/s and 2.9ºC/s) on the solidification parameters have been investigated. Differences in the resultant microstructure between wall and center of the molds have been analyzed and have been related to the T-t curve. Finally, the experimental results clearly indicate that the water-cooling rate of the molds and the melt temperature directly affects the solidification process as well as the final microstructure.

With the ever-growing emphasis on global decarbonization and rapid increases in the power density of electronics equipment in recent years, new methods and lightweight materials have been developed to manage heat load as well as interfacial stresses associated with Coefficient of Thermal Expansion (CTE) mismatch between components. The Al-Si system provides an attractive combination of CTE performance and high thermal conductivity whilst being a very lightweight option. Such materials are of interest to industries where thermal management is a key design criterion, such as aerospace, automotive, consumer electronics, defense, EV and space. This paper will describe the development and manufacture of a family of high-performance hypereutectic Al-Si alloys (AyontEX™) by a powder metallurgy method. These alloys are of particular interest for structural heat sink applications that require high reliability under thermal cycling (CTE of 17μm/(m·°C)) as well as reflective optics and instrument assemblies that require good thermal and mechanical stability (CTE of 13μm/(m·°C)). Critical performance relationships are presented, coupled with the microstructure, physical and mechanical properties of these Al-Si alloys.