ARTICLE
|
doi:10.20944/preprints202403.0639.v1
Subject:
Engineering,
Industrial And Manufacturing Engineering
Keywords:
Thinning process, Bifurcation, Buckling, Wafer, Warpage, Curvature, Finite Element Analysis (FEA), Simulations.
Online: 11 March 2024 (13:51:10 CET)
ARTICLE
|
doi:10.20944/preprints202402.1259.v1
Subject:
Engineering,
Mechanical Engineering
Keywords:
Bifurcation; Taiko wafers; Finite Element Analysis (FEA); ANSYS; Thermomechanical Simulations; Warpage; Modelling; Equivalent Thickness
Online: 22 February 2024 (07:50:28 CET)
ARTICLE
|
doi:10.20944/preprints202305.0318.v1
Subject:
Engineering,
Mechanical Engineering
Keywords:
Taiko Wafers; Finite Elements Analysis (FEA); ANSYS thermomechanical simulations
Online: 5 May 2023 (07:36:04 CEST)