REVIEW | doi:10.20944/preprints202107.0388.v2
Subject: Engineering, Automotive Engineering Keywords: Microelectronics; E-textile; Smart textile; Interconnection; textile-adapted
Online: 21 July 2021 (15:57:40 CEST)
Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.
ARTICLE | doi:10.20944/preprints201801.0052.v1
Subject: Engineering, Industrial & Manufacturing Engineering Keywords: interconnection; multi-layer patterning; laser sintering; femtosecond laser ablation
Online: 8 January 2018 (09:04:08 CET)
The development of printing technologies has enabled the realization of electric circuit fabrication on flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of laser focal position and intensity. Based on these methods, the flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated with functional operations.
ARTICLE | doi:10.20944/preprints201811.0158.v1
Subject: Engineering, Electrical & Electronic Engineering Keywords: Airborne wind energy; Direct interconnection technique; Load sharing control; Active power; Reactive power exchange; Non-reversing pumping mode
Online: 7 November 2018 (09:56:23 CET)
In this paper, an offshore airborne wind energy (AWE) farm consisting of three non-reversing pumping mode AWE systems is modelled and simulated. The AWE systems employ permanent magnet synchronous generators (PMSG). A direct interconnection technique is developed and implemented for AWE systems. This method is a new approach invented for interconnecting offshore wind turbines with the least number of required offshore-based power electronic converters. The direct interconnection technique can be beneficial in improving the economy and reliability of marine airborne wind energy systems. The performance and interactions of the directly interconnected generators inside the energy farm internal power grid are investigated. The results of the study conducted in this paper, show the directly interconnected AWE systems can exhibit a poor load balance and significant reactive power exchange which must be addressed. Power control strategies for controlling the active and reactive power of the AWE farm are designed, implemented, and promising results are discussed in this paper.