This article addresses the need to know the thermal conductivity in different filaments that this FDM technology uses. Because there are multiple applications that these additive manufacturing products play in the field of thermal insulation. For the study of thermal conductivity, the DTC-25 commercial conductivity measurement bench is used, where the tests will be carried out on a set of seven different materials with 100% fabrication density. From base materials such as acrylonitrile butadiene styrene (ABS) or polylactic acid (PLA), materials of high mechanical and thermal resistance, polyether ether ketone (PEEK) and high-performance polyetherimide thermoplastic (ULTEM), to materials with metal inclusions (aluminum 6061) that would later be subjected to thermal aftertreatments. The study shows how the parts manufactured with aluminum inclusion have a higher thermal conductivity, 0.40 ±0.05 W/m·K, compared to another material, such as TPU, of high mechanical and thermal resistance, with a conductivity of 0.26 ±0.05 W/m·K.