Laskowska, A. Characteristics of the Pressing Process and Density Profile of MUPF-Bonded Particleboards Produced from Waste Plywood. Materials2024, 17, 850.
Laskowska, A. Characteristics of the Pressing Process and Density Profile of MUPF-Bonded Particleboards Produced from Waste Plywood. Materials 2024, 17, 850.
Laskowska, A. Characteristics of the Pressing Process and Density Profile of MUPF-Bonded Particleboards Produced from Waste Plywood. Materials2024, 17, 850.
Laskowska, A. Characteristics of the Pressing Process and Density Profile of MUPF-Bonded Particleboards Produced from Waste Plywood. Materials 2024, 17, 850.
Abstract
The pressing process and density profile of particleboards produced with addition of waste wood containing phenol-formaldehyde (PF) resin was presented. The particles were melamine-urea-phenol-formaldehyde (MUPF) resinated. Recovered particles were obtained from post-industrial waste plywood. The press closing time recorded during the pressing of mats containing only recovered particles in the core layer (100%), at a unit pressure of 3 MPa, in which the face layer rate was 50%, resin load for face and core layer was 12% and 10% was shorter by 29% than for the industrial particle mats. Regardless of the level of variability of independent factors the overheating time of mats to a temperature of 100 °C, containing recovered particles was 10% - 20% shorter than the time of overheating mats with industrial particles. The greatest impact (52%) on maximum density of the face layer of particleboards was demonstrated by the content of the recovered particles and the resin load (32%). The maximum density area of the face layer was located closer to the surface in particleboards produced with a higher (80%, 100%) content of the recovered particles, a higher (i.e. 12% and 10%, respectively, for face and core layer) resin load, a lower (35%) face layer rate and a higher (3 MPa ) unit pressure.
Keywords
density profile; particleboard; pressing; recovered particles; recycling; resin
Subject
Engineering, Industrial and Manufacturing Engineering
Copyright:
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
