Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Grafting amino groups onto polyimide films in flexible copper clad laminates using helicon plasma

Chenggang Jing
,
Chen Wang
ORCID logo ,
Shitao Song
,
Yongqi Zhang
,
Jie Wan
,
Liang He
,
Ziping Qiao
,
Peng E
* ORCID logo
Version 1 : Received: 30 July 2023 / Approved: 1 August 2023 / Online: 1 August 2023 (11:53:36 CEST)

A peer-reviewed article of this Preprint also exists.

Jin, C.; Wang, C.; Song, S.; Zhang, Y.; Wan, J.; He, L.; Qiao, Z.; E, P. Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma. Materials 2023, 16, 6214. Jin, C.; Wang, C.; Song, S.; Zhang, Y.; Wan, J.; He, L.; Qiao, Z.; E, P. Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma. Materials 2023, 16, 6214.

Abstract

Polyimide (PI) films are widely used in electronic devices owing to their excellent mechanical and electrical properties and high thermal and chemical stabilities. In particular, PI films play an important role in flexible printed circuit boards (FPCBs). However, one challenge currently faced with their use is that the adhesives used in FPCBs cause a high dielectric loss in high-frequency applications. Therefore, it is envisioned that PI films with a low dielectric loss and Cu films can be used to prepare two-layer flexible copper clad laminates (FCCLs) without any adhesive. However, the preparation of ultra-thin FCCLs with no adhesives is difficult owing to the low peel strength between the PI films and Cu films. To address this technical challenge, an FCCL with no adhesive was prepared by high-power helicon wave plasma (HWP) treatment. The surface roughness of the PI film and the peel strength between the PI film and Cu film were measured. The experimental results showed that the surface roughness of the PI film increased by 40-65% and the PI film demonstrated improved adhesion (the peel strength was >8.0 N/cm) with the Cu film following plasma treatment and Cu plating.

Keywords

Flexible copper clad laminate; Polyimide; No adhesive; Helicon wave plasma; Roughness; Peel strength

Subject

Chemistry and Materials Science, Materials Science and Technology

Copyright: This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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