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Layout Dependence Stress Investigation In Through Glass via Interposer Architecture Using Submodeling Simulation Technique and Factorial Design Approach
Wang, S.-H.; Hsu, W.; Liou, Y.-Y.; Huang, P.-C.; Lee, C.-C. Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach. Micromachines2023, 14, 1506.
Wang, S.-H.; Hsu, W.; Liou, Y.-Y.; Huang, P.-C.; Lee, C.-C. Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach. Micromachines 2023, 14, 1506.
Wang, S.-H.; Hsu, W.; Liou, Y.-Y.; Huang, P.-C.; Lee, C.-C. Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach. Micromachines2023, 14, 1506.
Wang, S.-H.; Hsu, W.; Liou, Y.-Y.; Huang, P.-C.; Lee, C.-C. Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach. Micromachines 2023, 14, 1506.
Abstract
Multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and de activation technique in finite element analysis architecture. Submodeling technique is also utilized to mainly conquer the scale mismatch and difficulty in mesh gridding design. It is used as well to analyze the thermomechanical responses of glass interposer with chiplet arrangement and capped epoxy molding compound (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters on stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.
Keywords
Multi-chiplet; TGV; Finite element analysis; Submodeling technique; Analysis of variance
Subject
Engineering, Mechanical Engineering
Copyright:
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
