Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Synthesis and Characterization of an Environmentally Friendly Phenol-Formaldehyde Resin Modified With Waste Plant Protein

Version 1 : Received: 24 May 2023 / Approved: 25 May 2023 / Online: 25 May 2023 (10:55:13 CEST)

A peer-reviewed article of this Preprint also exists.

Li, H.; Wang, S.; Zhang, X.; Wu, H.; Wang, Y.; Zhou, N.; Zhao, Z.; Wang, C.; Zhang, X.; Wang, X.; Li, C. Synthesis and Characterization of an Environmentally Friendly Phenol–Formaldehyde Resin Modified with Waste Plant Protein. Polymers 2023, 15, 2975. Li, H.; Wang, S.; Zhang, X.; Wu, H.; Wang, Y.; Zhou, N.; Zhao, Z.; Wang, C.; Zhang, X.; Wang, X.; Li, C. Synthesis and Characterization of an Environmentally Friendly Phenol–Formaldehyde Resin Modified with Waste Plant Protein. Polymers 2023, 15, 2975.

Abstract

To develop a lower-cost, excellent performance, and environmentally friendly phe-nol-formaldehyde (PF) resin, soybean meal was used to modify PF resin, and soybean meal-phenol-formaldehyde (SMPF) resins were prepared. Their physicochemical properties and curing performance were investigated, showing that SMPF resins have higher curing tempera-tures than PF resin. The Fourier transform infrared spectroscopy (FTIR) results indicated that the cross-linking reaction occurred between the amino groups of soybean protein and the hy-droxymethyl phenol. Moreover, with the addition of soybean meal, the viscosity of SMPF in-creased while the gel time decreased. It is worth mentioning that SMPF-2 resin has favorable viscosity, short gel time, low curing temperature (135.78 °C), and high water resistance and bonding strength (1.01 MPa). Finally, all the plywoods bonded with SMPF resins have good water resistance and bonding strength, which could meet the Standard (GB/T 17657-2013, type I) for plywood. The optimized SMPF resins showed the potential application to replace part of PF resin in the wood industry.

Keywords

phenol-formaldehyde resin; soybean meal; soy-based adhesives; curing; plywood

Subject

Chemistry and Materials Science, Paper, Wood and Textiles

Comments (0)

We encourage comments and feedback from a broad range of readers. See criteria for comments and our Diversity statement.

Leave a public comment
Send a private comment to the author(s)
* All users must log in before leaving a comment
Views 0
Downloads 0
Comments 0
Metrics 0


×
Alerts
Notify me about updates to this article or when a peer-reviewed version is published.
We use cookies on our website to ensure you get the best experience.
Read more about our cookies here.