Li, H.; Yu, M.; Dai, J.; Zhou, G.; Sun, J. Upconversion Nanoparticle-Based Fluorescent Film for Distributed Temperature Monitoring of Mobile Phones’ Integrated Chips. Nanomaterials2023, 13, 1704.
Li, H.; Yu, M.; Dai, J.; Zhou, G.; Sun, J. Upconversion Nanoparticle-Based Fluorescent Film for Distributed Temperature Monitoring of Mobile Phones’ Integrated Chips. Nanomaterials 2023, 13, 1704.
Li, H.; Yu, M.; Dai, J.; Zhou, G.; Sun, J. Upconversion Nanoparticle-Based Fluorescent Film for Distributed Temperature Monitoring of Mobile Phones’ Integrated Chips. Nanomaterials2023, 13, 1704.
Li, H.; Yu, M.; Dai, J.; Zhou, G.; Sun, J. Upconversion Nanoparticle-Based Fluorescent Film for Distributed Temperature Monitoring of Mobile Phones’ Integrated Chips. Nanomaterials 2023, 13, 1704.
Abstract
As one of the most critical parameters to evaluate the quality and performance of mobile phones, real-time temperature monitoring of the mobile phone integrated chips is vitally important in the electronics industry. Although several different strategies for chip surface temperature measurement have been proposed in recent years, distributed temperature monitoring with the high spatial resolution is still a hot issue to be solved urgently. In this work, a fluorescent film material with photothermal properties containing thermosensitive upconversion nanoparticles (UCNPs) and polydimethylsiloxane (PDMS) is fabricated for chip surface temperature monitor-ing. The presented fluorescent films have thicknesses ranging from 23 to 90 μm and are both flexible and elastic. Using the fluorescence intensity ratio (FIR) technique, the temperature sens-ing properties of these fluorescent films are investigated. The maximum sensitivity of the fluo-rescent film was measured to be 1.43% K-1 at 299 K. By testing the temperature at different posi-tions of the optical film, a distributed temperature monitoring with a high spatial resolution down to 10 μm on the chip surface is successfully achieved. It is worth mentioning that the film maintains stable performance even under pull stretch up to 100%. The correctness of the method is verified by taking infrared images of the chip surface with an infrared camera. These results demonstrate that the as-prepared optical film is a promising anti-deformation material for high spatial resolution temperature monitoring on-chip surfaces.
Keywords
upconversion nanomaterials; ratiometric thermometry; Temperature sensing; Polymer composite film; Integrated chip temperature measurement
Subject
Physical Sciences, Optics and Photonics
Copyright:
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
