Wielandt, S.; Uhlemann, S.; Fiolleau, S.; Dafflon, B. Low-Power, Flexible Sensor Arrays with Solderless Board-To-Board Connectors for Monitoring Soil Deformation and Temperature. Sensors2022, 22, 2814.
Wielandt, S.; Uhlemann, S.; Fiolleau, S.; Dafflon, B. Low-Power, Flexible Sensor Arrays with Solderless Board-To-Board Connectors for Monitoring Soil Deformation and Temperature. Sensors 2022, 22, 2814.
Wielandt, S.; Uhlemann, S.; Fiolleau, S.; Dafflon, B. Low-Power, Flexible Sensor Arrays with Solderless Board-To-Board Connectors for Monitoring Soil Deformation and Temperature. Sensors2022, 22, 2814.
Wielandt, S.; Uhlemann, S.; Fiolleau, S.; Dafflon, B. Low-Power, Flexible Sensor Arrays with Solderless Board-To-Board Connectors for Monitoring Soil Deformation and Temperature. Sensors 2022, 22, 2814.
Abstract
Landslides are a global and frequent natural hazard, affecting many communities and infrastructure networks. Technological solutions are needed for long-term, large-scale condition monitoring of infrastructure earthworks, or natural slopes. However, current instruments for slope stability monitoring are often costly, require a complex installation process and/or data processing schemes, or have poor resolution. Wireless sensor networks comprising low-power, low-cost sensors have been shown to be a crucial part of landslide early warning systems. Here, we present the development of a novel sensing approach that uses linear arrays of three-axis accelerometers, used for monitoring soil deformation. By combining these deformation measurements with depth-resolved temperature measurements, we can link our data to subsurface thermal-hydrological regimes where relevant. In this research, we present a configuration of cascaded I2C sensors that (i) have ultra-low power consumption and (ii) enable an adjustable probe length. From an electromechanical perspective, we developed a novel board-to-board connection method that enables narrow, semi-flexible sensor arrays and a streamlined assembly process. The low-cost connection method relies on a specific FR4 printed circuit board design that allows board-to-board press-fitting without using electromechanical components or solder connections. The sensor assembly is placed in a thin, semi-flexible tube (inner diameter 6.35 mm) that is filled with an epoxy compound. The resulting sensor probe is connected to a AA battery powered data logger with wireless connectivity. We characterize the system's electromechanical properties and investigate the accuracy of deformation measurements. Our experiments performed with probes up to 1.8 m long demonstrate long-term connector stability, as well as probe mechanical flexibility. Furthermore, our accuracy analysis indicates that deformation measurements can be performed with a 0.390 mm resolution and a 95% confidence interval of ±0.73 mm per meter of probe length. This research shows the suitability of low-cost accelerometer arrays for distributed soil stability monitoring. In comparison to emerging low-cost measurements of surface displacement, our approach provides depth-resolved deformation, which can inform about shallow sliding surfaces.
Engineering, Electrical and Electronic Engineering
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