Preprint Article Version 1 Preserved in Portico This version is not peer-reviewed

Characterization of Low-Cost Inkjet Printed-Photonic Cured Strain Gauges for Remote Sensing and Structural Monitoring Applications

Version 1 : Received: 7 October 2021 / Approved: 8 October 2021 / Online: 8 October 2021 (09:25:09 CEST)

How to cite: Kerminen, J.; Wiklund, J.; Karakoç, A.; Ruttik, K.; Jäntti, R.; Yi̇ği̇tler, H. Characterization of Low-Cost Inkjet Printed-Photonic Cured Strain Gauges for Remote Sensing and Structural Monitoring Applications. Preprints 2021, 2021100131 (doi: 10.20944/preprints202110.0131.v1). Kerminen, J.; Wiklund, J.; Karakoç, A.; Ruttik, K.; Jäntti, R.; Yi̇ği̇tler, H. Characterization of Low-Cost Inkjet Printed-Photonic Cured Strain Gauges for Remote Sensing and Structural Monitoring Applications. Preprints 2021, 2021100131 (doi: 10.20944/preprints202110.0131.v1).

Abstract

In the present work, cost-effective strain gauges were fabricated by using inkjet printing and photonic curing on flexible and recyclable PET substrates. Ohmic resistance (a.k.a. DC resistance) (R0) and complex electrical impedance (Z) as a function of test frequency were characterized, respectively, with the state-of-the-art electronic testing equipments. For the fabrication process, commercially available silver nanoparticle (AgNP) inks and printing substrates were used in order to eliminate any apriori ink processing. In order to validate the in-house cantilever beam measurement setup and devices, first, commercially available metallic foil strain gauges (with the provided gauge factor GF=2 by the manufacturer) were tested at different locations. Thereafter, the printed strain gauges were investigated with several repetitions at different measurement locations. The measurement results demonstrated an affordable, rapid and tailorable design and repeatable fabrication approach for strain gauges with GFavg~6.6, which has potential applications in remote sensing and structural monitoring applications.

Keywords

Printed electronics; strain gauges; impedance; monitoring and sensing technologies

Subject

ENGINEERING, Other

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