Preprint Article Version 1 This version is not peer-reviewed

A MEMS Device for Quantitative in situ Mechanical Testing in Electron Microscope

Version 1 : Received: 29 December 2016 / Approved: 30 December 2016 / Online: 30 December 2016 (04:16:25 CET)

A peer-reviewed article of this Preprint also exists.

Wang, X.; Mao, S.; Zhang, J.; Li, Z.; Deng, Q.; Ning, J.; Yang, X.; Wang, L.; Ji, Y.; Li, X.; Liu, Y.; Zhang, Z.; Han, X. MEMS Device for Quantitative In Situ Mechanical Testing in Electron Microscope. Micromachines 2017, 8, 31. Wang, X.; Mao, S.; Zhang, J.; Li, Z.; Deng, Q.; Ning, J.; Yang, X.; Wang, L.; Ji, Y.; Li, X.; Liu, Y.; Zhang, Z.; Han, X. MEMS Device for Quantitative In Situ Mechanical Testing in Electron Microscope. Micromachines 2017, 8, 31.

Journal reference: Micromachines 2017, 8, 31
DOI: 10.3390/mi8020031

Abstract

In this work, we designed a MEMS device which allows simultaneous direct measurement of mechanical properties during deformation under external stress and characterization of the evolution of microstructure of nanomaterials within a transmission electron microscope. This MEMS device makes it easy to establish the correlation between microstructure and mechanical properties of nanomaterials. The device uses piezoresistive sensors to qualitatively measure the force and displacement of nanomaterials, e.g., in wire and thin plate forms. The device has a theoretical displacement resolution of 0.19 nm and a force resolution of 2.1 μN. The device has a theoretical displacement range limit of 2.74 μm and a load range limit of 27.75 mN.

Subject Areas

piezoresistive sensor; electron microscope; in situ mechanical test

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