Preprint Article Version 1 NOT YET PEER-REVIEWED

Aluminum Wires have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties and Bonding Characteristics of Nano Zn Film Al-Si Bonding Wires

Version 1 : Received: 18 November 2016 / Approved: 18 November 2016 / Online: 18 November 2016 (15:03:34 CET)

A peer-reviewed article of this Preprint also exists.

Hung, F.-Y.; Lui, T.-S.; Chu, K.-M.; Tseng, Y.-W. Aluminium Wires Have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties, and Bonding Characteristics of Nano Zn Film Al–Si Bonding Wires. Metals 2017, 7, 152. Hung, F.-Y.; Lui, T.-S.; Chu, K.-M.; Tseng, Y.-W. Aluminium Wires Have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties, and Bonding Characteristics of Nano Zn Film Al–Si Bonding Wires. Metals 2017, 7, 152.

Journal reference: Metals 2017, 7, 152
DOI: 10.3390/met7050152

Abstract

Aluminum wire is a common material for wire bonding due to its resistance to oxidation and low price. It does not melt when becoming a free air ball (FAB) during the electronic flame-off (EFO) process with wettability, and is applied by wedge bonding. This study used 20μm Zn-Coated Al-0.5wt.%Si (ZAS) wires to improve the FAB shape after the EFO process, while maintaining stability of the mechanical properties, including the interface bonding strength and hardness. In order to test circuit stability after ball bonding, the current-tensile test was performed. During the experiment, it was found that 80nm ZAS with wire bonding has lower resistance and higher fusing current. For the bias tensile test, the thicker Zn film diffused into the Al-Si matrix easily, after which the strength was reduced. The ball-bond interfaces had no change in their condition before and after the bias. Accordingly, ZAS could be a promising candidate for ball bonding in the future.

Subject Areas

Al wire, free air ball (FAB),electronic flame-off (EFO), coating, bias test

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